Inventor · disambiguated record
Shih-Wei Liang
Also filed as: LIANG SHIH · LIANG SHIH WEI
81 granted patents·17 pending applications·286 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD69TAIWAN SEMICONDUCTOR MFG14LIANG SHIH-WEI3CHEN HSIEN-WEI2MICRON TECHNOLOGY INC2
Top patents by PatentIndex Score
98 records- 0196US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
- 0296US9627332B1Integrated circuit structure and seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·22 cites·20 claims
- 0396US9224680B2Electrical connections for chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 29, 2015·20 cites·20 claims
- 0495US8912668B2Electrical connections for chip scale packagingCHEN HSIEN-WEI·Filed 2012·Granted Dec 16, 2014·16 cites·20 claims
- 0595US8581400B2Post-passivation interconnect structureLIANG SHIH-WEI·Filed 2011·Granted Nov 12, 2013·22 cites·20 claims
- 0694US9966321B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·8 cites·20 claims
- 0794US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
- 0893US9337154B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·14 cites·20 claims
- 0990US10497646B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·5 cites·20 claims
- 1090US8618827B2Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor deviceSHAO TUNG-LIANG·Filed 2010·Granted Dec 31, 2013·12 cites·20 claims
- 1189US9497861B2Methods and apparatus for package with interposersTAIWAN SEMIDONDUCTOR MFG COMPANY LTD·Filed 2012·Granted Nov 15, 2016·10 cites·20 claims
- 1289US2025336852A1Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1388US12322670B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·1 cites·20 claims
- 1488US9030010B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 12, 2015·7 cites·20 claims
- 1588US8901730B2Methods and apparatus for package on package devicesLIU MING-KAI·Filed 2012·Granted Dec 2, 2014·9 cites·20 claims
- 1687US8624359B2Wafer level chip scale package and method of manufacturing the sameYANG CHUNG-YING·Filed 2011·Granted Jan 7, 2014·7 cites·22 claims
- 1786US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
- 1886US9698079B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·5 cites·20 claims
- 1986US9082761B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 14, 2015·5 cites·20 claims
- 2086US8957503B2Chip package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 17, 2015·6 cites·15 claims
- 2186US8237160B2Probe pad on a corner stress relief region in a semiconductor chipCHEN HSIEN-WEI·Filed 2011·Granted Aug 7, 2012·8 cites·20 claims
- 2285US11114357B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
- 2384US2025323148A1Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2484US2025355176A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2583US9006891B2Method of making a semiconductor device having a post-passivation interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·5 cites·20 claims
- 2683US2025347847A1Optical device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2782US12322696B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 2882US10157900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 2982US9543263B2Semiconductor packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·4 cites·20 claims
- 3082US2025347865A1Optical fiber coupling structure for photonic packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3181US9786618B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 3281US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
- 3381US9461106B1MIM capacitor and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·4 cites·20 claims
- 3481US8994181B2Bond pad structure to reduce bond pad corrosionCHEN YING-JU·Filed 2011·Granted Mar 31, 2015·6 cites·20 claims
- 3579US2025349650A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3678US12412852B2Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 3778US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
- 3878US9852985B1Conductive terminal on integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
- 3978US9799615B1Package structures having height-adjusted molding members and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·3 cites·19 claims
- 4078US9653418B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·20 claims
- 4178US9373599B2Methods and apparatus for package on package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·3 cites·20 claims
- 4277US10269737B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 4376US12218035B2Barrier structures between external electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 4476US11171109B2Techniques for forming semiconductor device packages and related packages, intermediate products, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·2 cites·15 claims
- 4576US9263405B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·3 cites·20 claims
- 4676US2025306300A1Optical fiber coupling structure for photonic packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4775US10522437B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·1 cites·20 claims
- 4875US2024427081A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4975US2024377580A1Optical device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5074US9437567B2Semiconductor devices with ball strength improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·2 cites·20 claims
Showing the top 50 of 98 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →