Inventor · disambiguated record
Shun-Hsing Liao
Also filed as: LIAO SHUN-HSING · Liao shun
1 granted patent·14 pending applications·0 citations·filing 2021–2023
7Inventor score
Top patents by PatentIndex Score
15 records- 0151US2025000459A1Detecting Low Ejection Fraction using Photoplethysmography (PPG)GOOGLE LLC·Filed 2023·Application pending·0 cites
- 0240US2024355719A1Thin semiconductor device and method of manufacturing thin semiconductor deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2023·Application pending·0 cites
- 0338US2024363994A1Antenna device and method of manufacturing antenna deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2023·Application pending·0 cites
- 0438US2024379489A1Semiconductor package device and method of manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2023·Application pending·0 cites
- 0538US2023350023A1High-accuracy optical sensor for distance measurement and method for manufacturing optical sensorSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2022·Application pending·0 cites
- 0637US11972998B2Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2021·Granted Apr 30, 2024·0 cites·12 claims
- 0737US2024347484A1Semiconductor packaging device and manufacturing method for semiconductor packaging deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2023·Application pending·0 cites
- 0836US2024079344A1Packaging assembly for semiconductor device and method of makingSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2023·Application pending·0 cites
- 0935US2023079384A1Optical sensor and method for manufacturing optical sensorSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2021·Application pending·0 cites
- 1034US2024038742A1Semiconductor package device and method of manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2022·Application pending·0 cites
- 1134US2024030164A1Semiconductor package device and method of manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2022·Application pending·0 cites
- 1233US2022291378A1Optical sensor and method for manufacturing optical sensorSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2021·Application pending·0 cites
- 1333US2022299639A1Optical sensor and method for manufacturing optical sensorSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2021·Application pending·0 cites
- 1432US2023127545A1Semiconductor package device with heat-removing function and method of manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2022·Application pending·0 cites
- 1531US2023130923A1Semiconductor package device and method for manufacturing semiconductor package deviceSHUNSIN TECHNOLOGY ZHONG SHAN LIMITED·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →