Inventor · disambiguated record
Shuhang Liao
Also filed as: LIAO SHUHANG
12 granted patents·2 pending applications·1 citations·filing 2020–2024
79Inventor score
Top patents by PatentIndex Score
14 records- 0190US12037488B1Liquid molding compound and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2024·Granted Jul 16, 2024·1 cites·10 claims
- 0278US12024591B2Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrateWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·7 claims
- 0374US12209171B2Liquid epoxy molding compound and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·5 claims
- 0468US12252613B1Packaging film and preparation method thereof, and filter chip packaging methodWUHAN CHOICE TECH CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·12 claims
- 0561US12098230B2Build-up film with low dielectric loss, preparation method therefor and circuit substrate structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·11 claims
- 0661US11767450B2Adhesive, die attach film and preparation method thereforWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Sep 26, 2023·0 cites·10 claims
- 0760US11978686B2Chip protective film and method for manufacturing same, and chipWUHAN CHOICE TECH CO LTD·Filed 2023·Granted May 7, 2024·0 cites·7 claims
- 0860US11879076B1Composition, adhesive film and chip packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Jan 23, 2024·0 cites·11 claims
- 0960US11804463B2Underfill for chip packaging and chip packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Oct 31, 2023·0 cites·8 claims
- 1059US12255175B1Wafer warpage regulation epoxy functional film, and preparation method and application thereofWUHAN SANXUAN TECH CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·4 claims
- 1151US2024030075A1Die sealant for chip packaging and packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Application pending·0 cites
- 1249US2023295415A1High-glossiness epoxy molding compound (emc) film for protecting chip and preparation method thereofWUHAN CHOICE TECH CO LTD·Filed 2023·Application pending·0 cites
- 1347US11286386B1Circuit build-up film for wafer-level packaging, and fabrication method and use thereofWUHAN CHOICE TECH CO LTD·Filed 2021·Granted Mar 29, 2022·0 cites·20 claims
- 1443US11643499B2Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereofHUBEI CHOICE TECH CO LTD·Filed 2020·Granted May 9, 2023·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →