Inventor · disambiguated record
Shih-An Liao
Also filed as: LIAO SHIH-AN
27 granted patents·8 pending applications·21 citations·filing 2014–2025
93Inventor score
Files withEPISTAR CORP35
Top patents by PatentIndex Score
35 records- 0194US11519564B2Light emitting bulbEPISTAR CORP·Filed 2021·Granted Dec 6, 2022·2 cites·10 claims
- 0288US10205070B2Light-emitting device having dissimilar first and second light-emitting anglesEPISTAR CORP·Filed 2016·Granted Feb 12, 2019·6 cites·14 claims
- 0387US10873014B2Light-emitting deviceEPISTAR CORP·Filed 2018·Granted Dec 22, 2020·3 cites·18 claims
- 0485US9664340B2Light emitting deviceEPISTAR CORP·Filed 2014·Granted May 30, 2017·5 cites·20 claims
- 0584US2025275317A1Light-emitting deviceEPISTAR CORP·Filed 2025·Application pending·0 cites
- 0681US11362060B2Method and structure for die bonding using energy beamEPISTAR CORP·Filed 2019·Granted Jun 14, 2022·2 cites·20 claims
- 0780US12119321B2Semiconductor device and a method of manufacturing thereofEPISTAR CORP·Filed 2022·Granted Oct 15, 2024·0 cites·14 claims
- 0879US12154885B2Method and structure for die bonding using energy beamEPISTAR CORP·Filed 2023·Granted Nov 26, 2024·0 cites·15 claims
- 0977US12300776B2Light-emitting deviceEPISTAR CORP·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 1076US11578838B2Light emitting bulbEPISTAR CORP·Filed 2022·Granted Feb 14, 2023·0 cites·10 claims
- 1175US10403789B2Light-emitting element and the manufacturing method thereofEPISTAR CORP·Filed 2017·Granted Sep 3, 2019·2 cites·8 claims
- 1274US11728310B2Method and structure for die bonding using energy beamEPISTAR CORP·Filed 2022·Granted Aug 15, 2023·0 cites·10 claims
- 1373US11450639B2Semiconductor device and a method of manufacturing thereofEPISTAR CORP·Filed 2021·Granted Sep 20, 2022·0 cites·20 claims
- 1473US10222002B2Light emitting bulbEPISTAR CORP·Filed 2017·Granted Mar 5, 2019·1 cites·13 claims
- 1572US11380828B2Light-emitting deviceEPISTAR CORP·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 1671US10910335B2Semiconductor device and a method of manufacturing thereofEPISTAR CORP·Filed 2020·Granted Feb 2, 2021·0 cites·19 claims
- 1765US11355677B2Light-emitting element and the manufacturing method thereofEPISTAR CORP·Filed 2019·Granted Jun 7, 2022·0 cites·13 claims
- 1863US12272774B2Light-emitting device and the method of manufacturing the sameEPISTAR CORP·Filed 2021·Granted Apr 8, 2025·0 cites·8 claims
- 1963US10622325B2Semiconductor device and a method of manufacturing thereofEPISTAR CORP·Filed 2018·Granted Apr 14, 2020·0 cites·16 claims
- 2063US2025081699A1Semiconductor device and fabrication method thereofEPISTAR CORP·Filed 2024·Application pending·0 cites
- 2162US2024363817A1Semiconductor device and manufacturing method thereofEPISTAR CORP·Filed 2023·Application pending·0 cites
- 2260US11054088B2Light emitting bulbEPISTAR CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 2359US10586902B2Light-emitting device having dissimilar first and second light-emitting anglesEPISTAR CORP·Filed 2018·Granted Mar 10, 2020·0 cites·20 claims
- 2458US2024405181A1Semiconductor device arrangement and method of manufacturing the sameEPISTAR CORP·Filed 2024·Application pending·0 cites
- 2557US11530804B2Light-emitting deviceEPISTAR CORP·Filed 2021·Granted Dec 20, 2022·0 cites·19 claims
- 2657US10170440B2Semiconductor device and a method of manufacturing thereofEPISTAR CORP·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 2757US2024203920A1SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOFEPISTAR CORP·Filed 2023·Application pending·0 cites
- 2856US10714666B2Light-emitting deviceEPISTAR CORP·Filed 2019·Granted Jul 14, 2020·0 cites·19 claims
- 2955US2023119631A1Semiconductor device and manufacturing method thereofEPISTAR CORP·Filed 2022·Application pending·0 cites
- 3053US11011681B2Light-emitting device and the method of manufacturing the sameEPISTAR CORP·Filed 2014·Granted May 18, 2021·0 cites·9 claims
- 3153US10230033B2Light-emitting deviceEPISTAR CORP·Filed 2017·Granted Mar 12, 2019·0 cites·19 claims
- 3251US2022302357A1Light-emitting element and the manufacturing method thereofEPISTAR CORP·Filed 2022·Application pending·0 cites
- 3350US11588084B2Method and structure for die bonding using energy beamEPISTAR CORP·Filed 2020·Granted Feb 21, 2023·0 cites·17 claims
- 3449US10770636B2Light emitting device and manufacturing method thereofEPISTAR CORP·Filed 2019·Granted Sep 8, 2020·0 cites·19 claims
- 3540US2019259923A1Light-emitting deviceEPISTAR CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →