Inventor · disambiguated record
Shawna M. Liff
Also filed as: LIFF SHAWNA · LIFF SHAWNA M · LIFF SHAWNA MARIE
201 granted patents·89 pending applications·602 citations·filing 2005–2025
99Inventor score
Top patents by PatentIndex Score
290 records- 0198US12080652B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2023·Granted Sep 3, 2024·3 cites·20 claims
- 0298US11990448B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted May 21, 2024·5 cites·18 claims
- 0398US10380496B2Quantum computing assembliesINTEL CORP·Filed 2018·Granted Aug 13, 2019·50 cites·25 claims
- 0498US9275955B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2013·Granted Mar 1, 2016·49 cites·17 claims
- 0597US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0697US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0797US11824018B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0897US11469209B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Oct 11, 2022·3 cites·28 claims
- 0997US11348895B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted May 31, 2022·3 cites·23 claims
- 1096US12057402B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Aug 6, 2024·3 cites·20 claims
- 1196US11967580B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2022·Granted Apr 23, 2024·2 cites·19 claims
- 1296US11955434B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2022·Granted Apr 9, 2024·2 cites·22 claims
- 1396US11791277B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Oct 17, 2023·2 cites·15 claims
- 1496US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 1596US11217535B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2017·Granted Jan 4, 2022·12 cites·20 claims
- 1696US10943851B1Reconstituted wafer assemblyINTEL CORP·Filed 2019·Granted Mar 9, 2021·18 cites·22 claims
- 1796US10319896B2Shielded interconnectsINTEL CORP·Filed 2017·Granted Jun 11, 2019·19 cites·25 claims
- 1895US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 1995US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 2095US11335642B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·9 cites·19 claims
- 2195US11335663B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·8 cites·19 claims
- 2295US10054737B2Optical I/O system using planar light-wave integrated circuitINTEL CORP·Filed 2016·Granted Aug 21, 2018·12 cites·25 claims
- 2394US11075166B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2020·Granted Jul 27, 2021·3 cites·18 claims
- 2494US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 2594US9832863B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Nov 28, 2017·10 cites·6 claims
- 2694US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 2793US12224261B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 11, 2025·2 cites·15 claims
- 2893US11616047B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 2993US11581282B2Serializer-deserializer die for high speed signal interconnectINTEL CORP·Filed 2018·Granted Feb 14, 2023·10 cites·8 claims
- 3093US11494682B2Quantum computing assembliesINTEL CORP·Filed 2017·Granted Nov 8, 2022·10 cites·20 claims
- 3193US10418329B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2015·Granted Sep 17, 2019·11 cites·23 claims
- 3293US10068852B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2017·Granted Sep 4, 2018·8 cites·19 claims
- 3393US9507086B2Optical I/O system using planar light-wave integrated circuitKOBRINSKY MAURO J·Filed 2011·Granted Nov 29, 2016·19 cites·9 claims
- 3492US11437348B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2020·Granted Sep 6, 2022·2 cites·14 claims
- 3592US11270947B2Composite interposer structure and method of providing sameINTEL CORP·Filed 2019·Granted Mar 8, 2022·5 cites·20 claims
- 3692US11049791B1Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·7 cites·22 claims
- 3792US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 3892US10122089B2Magnetic nanocomposite materials and passive components formed therewithINTEL CORP·Filed 2016·Granted Nov 6, 2018·7 cites·7 claims
- 3992US10081887B2Electrically functional fabric for flexible electronicsINTEL CORP·Filed 2012·Granted Sep 25, 2018·18 cites·31 claims
- 4092US9461355B2Method apparatus and material for radio frequency passives and antennasNAIR VIJAY K·Filed 2013·Granted Oct 4, 2016·14 cites·29 claims
- 4192US2025349820A1Microelectronic assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 4291US11600594B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Mar 7, 2023·1 cites·20 claims
- 4391US11462463B2Microelectronic assemblies having an integrated voltage regulator chipletINTEL CORP·Filed 2018·Granted Oct 4, 2022·6 cites·12 claims
- 4491US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 4591US11133263B2High-density interconnects for integrated circuit packagesINTEL CORP·Filed 2019·Granted Sep 28, 2021·6 cites·22 claims
- 4691US9842818B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2016·Granted Dec 12, 2017·7 cites·16 claims
- 4790US11227859B2Stacked package with electrical connections created using high throughput additive manufacturingINTEL CORP·Filed 2017·Granted Jan 18, 2022·6 cites·25 claims
- 4890US11183477B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2019·Granted Nov 23, 2021·6 cites·15 claims
- 4990US11094672B2Composite IC chips including a chiplet embedded within metallization layers of a host IC chipINTEL CORP·Filed 2019·Granted Aug 17, 2021·5 cites·20 claims
- 5090US10070520B2Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2015·Granted Sep 4, 2018·6 cites·18 claims
Showing the top 50 of 290 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →