Inventor · disambiguated record
Shih-Ting Lin
Also filed as: LIN SHIH-TING
78 granted patents·36 pending applications·338 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD48IND TECH RES INST19MAPLEBEAR INC16NANYA TECHNOLOGY CORP10TAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
114 records- 0198US11469197B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·4 cites·20 claims
- 0298US8643148B2Chip-on-Wafer structures and methods for forming the sameLIN JING-CHENG·Filed 2012·Granted Feb 4, 2014·116 cites·19 claims
- 0397US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 0497US11355454B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·7 cites·20 claims
- 0597US9831224B2Solution for reducing poor contact in info packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·17 cites·20 claims
- 0696US10157888B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0795US11769739B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0895US9793187B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·15 cites·20 claims
- 0995US9412662B2Structure and approach to prevent thin wafer crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 9, 2016·22 cites·19 claims
- 1092US11948896B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·1 cites·20 claims
- 1192US9281297B2Solution for reducing poor contact in info packagesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·8 cites·20 claims
- 1292US8695426B2Micro-electromechanical system device having electrical insulating structure and manufacturing methodsHSU YU WEN·Filed 2011·Granted Apr 15, 2014·9 cites·18 claims
- 1391US10825693B2Carrier warpage control for three dimensional integrated circuit (3DIC) stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·5 cites·14 claims
- 1491US10438934B1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 8, 2019·6 cites·20 claims
- 1590US9514988B1Semiconductor devices and packaging methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·7 cites·20 claims
- 1688US11543312B2Spindle shaft device with torque sensorIND TECH RES INST·Filed 2021·Granted Jan 3, 2023·2 cites·20 claims
- 1787US10985140B2Structure and formation method of package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·20 claims
- 1887US10923438B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·3 cites·20 claims
- 1987US10153179B2Carrier warpage control for three dimensional integrated circuit (3DIC) stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 11, 2018·7 cites·9 claims
- 2085US12020952B2Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 2185US11476205B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 18, 2022·1 cites·20 claims
- 2285US11411161B2Piezoelectric sensing system and piezoelectric sensing circuitIND TECH RES INST·Filed 2020·Granted Aug 9, 2022·2 cites·16 claims
- 2385US11056436B2Integrated fan-out structure with rugged interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 6, 2021·4 cites·20 claims
- 2485US10347612B2Solution for reducing poor contact in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·2 cites·20 claims
- 2585US10290513B2Carrier warpage control for three dimensional integrated circuit (3DIC) stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·3 cites·10 claims
- 2685US9123643B2Chip-on-wafer structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Sep 1, 2015·4 cites·20 claims
- 2784US2024379602A1Methods of forming integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2883US12424576B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2983US10566432B2Transistor deviceNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 18, 2020·2 cites·15 claims
- 3081US11417606B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·1 cites·14 claims
- 3181US9227841B2Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the sameHUANG CHAO TA·Filed 2014·Granted Jan 5, 2016·5 cites·27 claims
- 3281US2024203906A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3381US2025266356A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3480US8809972B2Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the sameHUANG CHAO TA·Filed 2011·Granted Aug 19, 2014·5 cites·12 claims
- 3580US7773640B2Fiber laser deviceIND TECH RES INST·Filed 2009·Granted Aug 10, 2010·6 cites·13 claims
- 3680US2025384211A1Using unsupervised clustering and language model to normalize attribute tuples of items in a databaseMAPLEBEAR INC·Filed 2025·Application pending·0 cites
- 3779US12315806B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 3879US12142579B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3979US8311065B2Fiber laser systemTSAI TZONG-YOW·Filed 2011·Granted Nov 13, 2012·8 cites·12 claims
- 4079US2024387198A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4178US11817410B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 4277US9502271B2Warpage control for flexible substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·3 cites·20 claims
- 4377US9418876B2Method of three dimensional integrated circuit assemblyLIN JING-CHENG·Filed 2011·Granted Aug 16, 2016·4 cites·21 claims
- 4476US12165978B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 4576US8962481B2Chip-on-wafer structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 24, 2015·3 cites·20 claims
- 4676US2024304466A1Method of fabricating semiconductor device having dummy micro bumps between stacking diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4775US12400878B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 4875US2024347467A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4974US12292455B2Chip socket, testing fixture and chip testing method thereofNANYA TECHNOLOGY CORP·Filed 2024·Granted May 6, 2025·0 cites·13 claims
- 5074US8857259B2Reading circuit of gyroscopeHSU YU-WEN·Filed 2012·Granted Oct 14, 2014·6 cites·16 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Shih-Ting Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →