Inventor · disambiguated record
Shih-Ho Lin
Also filed as: LIN SHIH-HO
25 granted patents·7 pending applications·78 citations·filing 2004–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19TAIWAN SEMICONDUCTOR MFG7CHEN KEI-WEI2LO CHIH-WEI2CHANG SHIH-CHIEH1
Top patents by PatentIndex Score
32 records- 0193US10170343B1Post-CMP cleaning apparatus and method with brush self-cleaning functionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·14 cites·20 claims
- 0292US11043251B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·11 cites·20 claims
- 0385US10843307B2Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·3 cites·20 claims
- 0483US11251063B2Article transporter in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·1 cites·20 claims
- 0582US12409529B2Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 9, 2025·1 cites·20 claims
- 0678US12076831B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0778US11094554B2Polishing process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 17, 2021·4 cites·20 claims
- 0877US2024383100A1Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0975US12154608B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1074US11673223B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 1173US12009222B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1268US11239092B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 1368US8470390B2Oxidation-free copper metallization process using in-situ bakingWANG YU-SHENG·Filed 2008·Granted Jun 25, 2013·3 cites·20 claims
- 1468US7071100B2Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene processCHEN KEI-WEI·Filed 2004·Granted Jul 4, 2006·20 cites·22 claims
- 1568US2023278160A1Method and system for performing chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1667US11990167B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1762US7803257B2Current-leveling electroplating/electropolishing electrodeTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 28, 2010·6 cites·28 claims
- 1859US10636673B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1959US8587649B2Lane departure warning systemLO CHIH-WEI·Filed 2009·Granted Nov 19, 2013·7 cites·11 claims
- 2058US11292101B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·20 claims
- 2156US10804133B2Article transferring method in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·20 claims
- 2255US11685015B2Method and system for performing chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 27, 2023·0 cites·20 claims
- 2353US7128821B2Electropolishing method for removing particles from wafer surfaceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 31, 2006·4 cites·19 claims
- 2451US8099861B2Current-leveling electroplating/electropolishing electrodeCHANG SHIH-CHIEH·Filed 2010·Granted Jan 24, 2012·0 cites·20 claims
- 2550US7304728B2Test device and method for laser alignment calibrationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 4, 2007·3 cites·13 claims
- 2647US9502290B2Oxidation-free copper metallization process using in-situ bakingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·20 claims
- 2745US2010013929A1Event Data Recorder with Lane Departure Warning FunctionLO CHIH-WEI·Filed 2008·Application pending·0 cites
- 2844US7312149B2Copper plating of semiconductor devices using single intermediate low power immersion stepTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 25, 2007·1 cites·21 claims
- 2943US2007205516A1Low-k dielectric layer, semiconductor device, and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3042US2007084730A1Plating apparatuses and processesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3141US2009127097A1Forming Seed Layer in Nano-Trench Structure Using Net Deposition and Net EtchCHEN KEI-WEI·Filed 2007·Application pending·0 cites
- 3236US2005236181A1Novel ECP method for preventing the formation of voids and contamination in viasTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →