Inventor · disambiguated record
Shiang-Chi Lin
Also filed as: LIN SHIANG-CHI
17 granted patents·4 pending applications·43 citations·filing 2014–2025
90Inventor score
Top patents by PatentIndex Score
21 records- 0197US9567209B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·15 cites·20 claims
- 0296US9459224B1Gas sensor, integrated circuit device using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·18 cites·17 claims
- 0391US9938134B2Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·7 cites·20 claims
- 0485US11798307B2Under-display ultrasonic fingerprint sensors for foldable displaysQUALCOMM INC·Filed 2021·Granted Oct 24, 2023·1 cites·31 claims
- 0583US10618804B2Manufacturing method of semiconductor structure including heaterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·20 claims
- 0683US10035700B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·1 cites·20 claims
- 0779US12169977B2Under-display ultrasonic fingerprint sensors for foldable displaysQUALCOMM INC·Filed 2023·Granted Dec 17, 2024·0 cites·28 claims
- 0877US12217530B2Under-display ultrasonic fingerprint sensors for foldable displaysQUALCOMM INC·Filed 2023·Granted Feb 4, 2025·0 cites·30 claims
- 0976US12494080B2Devices configured for near-field ultrasonic imagingQUALCOMM INC·Filed 2024·Granted Dec 9, 2025·0 cites·29 claims
- 1074US11254564B2Semiconductor manufacturing method and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 1174US2025174037A1Under-display ultrasonic fingerprint sensors for foldable displaysQUALCOMM INC·Filed 2025·Application pending·0 cites
- 1272US12416996B2Devices including one or more high-impedance layers between a display stack and an ultrasonic fingerprint sensor stackQUALCOMM INC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 1371US11148936B2CMOS-MEMS structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·19 claims
- 1467US10508027B2CMOS-MEMS structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·15 claims
- 1565US10046965B2CMOS-MEMS structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 1663US11910716B1Ultrasonic sensor system and multi-layer stiffener for foldable displayQUALCOMM INC·Filed 2023·Granted Feb 20, 2024·0 cites·23 claims
- 1762US9630831B1Semiconductor sensing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
- 1855US2025241191A1Mitigation of visual defect in a displayQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1944US11505454B2MEMS structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 2044US2015177188A1Microfluidic deviceUNIV NAT TAIWAN·Filed 2014·Application pending·0 cites
- 2142US2015014171A1Microfluidic particle separation deviceUNIV NAT TAIWAN·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →