Inventor · disambiguated record
Shih-Wei Lin
Also filed as: LIN SHIH-CHIN · LIN SHIH-WEI
66 granted patents·29 pending applications·273 citations·filing 1996–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD50LIN SHIH-WEI8GRAPE KING BIO LTD6QUANTA COMP INC3CHENG UEI PREC IND CO LTD2
Top patents by PatentIndex Score
95 records- 0198US10103122B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·26 cites·20 claims
- 0298US9567208B1Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·17 cites·19 claims
- 0398US9417209B2Biosensing well array with protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·24 cites·22 claims
- 0498US9023674B2Biosensing well array with protective layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 5, 2015·56 cites·20 claims
- 0596US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
- 0695US11256114B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 0795US9815685B2Semiconductor sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·11 cites·20 claims
- 0894US10354972B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·7 cites·20 claims
- 0991US9224615B2Noble gas bombardment to reduce scallops in bosch etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 29, 2015·12 cites·20 claims
- 1090US11749762B2Semiconductor device comprising a photodetector with reduced dark currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 5, 2023·2 cites·20 claims
- 1190US9748198B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·5 cites·20 claims
- 1289US11209673B2Heater structure configured to improve thermal efficiency in a modulator deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·2 cites·20 claims
- 1388US11226506B2Heater structure with a gas-filled isolation structure to improve thermal efficiency in a modulator deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·2 cites·20 claims
- 1488US10766763B2Sidewall stopper for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·4 cites·20 claims
- 1588US10283700B2Semiconductor memory structure with magnetic tunnel junction (MTJ) cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·5 cites·20 claims
- 1688US2025327973A1Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1788US2025344528A1Channel pattern design to improve carrier transfer efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1886US11740412B2Structure including waveguide and isolation spaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 1985US12345920B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 2085US10276634B2Semiconductor memory structure with magnetic tunnel junction (MTJ) cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 2185US10048220B2Biosensor field effect transistor having specific well structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·2 cites·18 claims
- 2284US2025346482A1Micro-electromechanical system device including a precision proof mass element and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2383US7349206B2Notebook computer expansion moduleQUANTA COMP INC·Filed 2005·Granted Mar 25, 2008·16 cites·9 claims
- 2483US2025048753A1Channel pattern design to improve carrier transfer efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2582US12006208B2Micro-electromechanical system device including a precision proof mass element and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 2682US9091647B2Direct sensing bioFETs and methods of manufactureCHANG YI-HSIEN·Filed 2012·Granted Jul 28, 2015·4 cites·14 claims
- 2781US12265262B2Source/drain feature separation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2880US9228974B2Biosensing well array by self-alignment and selective etchingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 5, 2016·3 cites·20 claims
- 2980US8409456B2Planarization method for high wafer topographyLAN SHUN-WEI·Filed 2011·Granted Apr 2, 2013·8 cites·24 claims
- 3079US2025224568A1Source/drain feature separation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3178US12136679B2Semiconductor device comprising a photodetector with reduced dark currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 3278US11675129B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 3378US2024372018A1Semiconductor device comprising a photodetector with reduced dark currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3477US12183764B2Channel pattern design to improve carrier transfer efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 3577US9210821B2Locking assembly and communication apparatus using sameLIN SHIH-WEI·Filed 2012·Granted Dec 8, 2015·3 cites·18 claims
- 3676US12235689B2Cable arrangement mechanismQUANTA COMP INC·Filed 2023·Granted Feb 25, 2025·1 cites·10 claims
- 3775US11634320B2Micro-electromechanical system device including a precision proof mass element and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 3875US11203522B2Sidewall stopper for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 3975US9058849B2Electronic device with hard disk frameHON HAI PREC IND CO LTD·Filed 2014·Granted Jun 16, 2015·3 cites·20 claims
- 4075US7604264B2Hook shaft balance connection structureQUANTA COMP INC·Filed 2007·Granted Oct 20, 2009·9 cites·4 claims
- 4175US2024379400A1Wafer chuck structure with holes in upper surface to improve temperature uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4274US12391545B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 4374US12043537B2Method of manufacturing a microelectromechanical systems (MEMS) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 4472US11904917B2Anti-collision control method and rail vehicle control systemMIRLE AUTOMATION CORP·Filed 2021·Granted Feb 20, 2024·1 cites·11 claims
- 4572US11714299B2Heater structure configured to improve thermal efficiency in a modulator deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 4671US11253556B2Lactobacillus fermentum GKF3, composition comprising the strain and method for improving psychataxia using the sameGRAPE KING BIO LTD·Filed 2019·Granted Feb 22, 2022·1 cites·4 claims
- 4771US8462521B2Shielding assemblyLIN SHIH-WEI·Filed 2011·Granted Jun 11, 2013·2 cites·3 claims
- 4870US11921325B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 4970US9434076B2Robot blade designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·2 cites·20 claims
- 5069US8728845B2Method and apparatus for selectively removing anti-stiction coatingLIN SHIH-WEI·Filed 2011·Granted May 20, 2014·2 cites·21 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →