Inventor · disambiguated record
Shiau-Shi Lin
Also filed as: LIN SHIAU SHI
6 granted patents·2 pending applications·2 citations·filing 2015–2024
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0173US12113008B1Semiconductor chip package including lead frame and manufacturing method thereofDIODES INC·Filed 2024·Granted Oct 8, 2024·0 cites·19 claims
- 0270US10573618B1Package structures and methods for fabricating the sameDELTA ELECTRONICS INC·Filed 2018·Granted Feb 25, 2020·2 cites·18 claims
- 0369US2025038096A1Semiconductor Chip Package and Manufacturing Method ThereofDIODES INC·Filed 2024·Application pending·0 cites
- 0457US12205934B2Electronic component package and manufacuring method thereofDIODES INC·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 0544US10741644B2Semiconductor devices with via structure and package structures comprising the sameDELTA ELECTRONICS INC·Filed 2016·Granted Aug 11, 2020·0 cites·26 claims
- 0641US10056319B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2017·Granted Aug 21, 2018·0 cites·17 claims
- 0738US10978403B2Package structure and method for fabricating the sameDELTA ELECTRONICS INC·Filed 2019·Granted Apr 13, 2021·0 cites·13 claims
- 0831US2016260660A1Electronic device and electronic package thereofDELTA ELECTRONICS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →