Inventor · disambiguated record

Shih-Jang Lin

Also filed as: LIN SHIH-JANG

4 granted patents·291 citations·filing 2000–2003

83Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG4

Top patents by PatentIndex Score

4 records

0196US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
0293US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
0386US6958546B2Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·45 cites·9 claims
0478US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →