Inventor · disambiguated record
Shih-Jane Lin
Also filed as: LIN SHIH-JANE
12 granted patents·385 citations·filing 2000–2008
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG12
Top patents by PatentIndex Score
12 records- 0196US6482669B1Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·81 cites·13 claims
- 0293US6605524B1Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·78 cites·24 claims
- 0391US7183598B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·10 cites·17 claims
- 0491US6632700B1Method to form a color image sensor cell while protecting the bonding pad structure from damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 14, 2003·58 cites·20 claims
- 0585US7816169B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 19, 2010·5 cites·20 claims
- 0685US6956292B2Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·37 cites·20 claims
- 0783US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 0882US6649507B1Dual layer photoresist method for fabricating a mushroom bumping plating structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·33 cites·25 claims
- 0976US7485906B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·2 cites·20 claims
- 1075US6372545B1Method for under bump metal patterning of bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·22 cites·35 claims
- 1173US6876049B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·12 cites·20 claims
- 1262US6426283B1Method for bumping and backlapping a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 30, 2002·10 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →