Inventor · disambiguated record
Shen-Bo Lin
Also filed as: LIN SHEN BO
8 granted patents·12 pending applications·14 citations·filing 2008–2013
80Inventor score
Top patents by PatentIndex Score
20 records- 0177US8378378B2Light emitting diode package and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Feb 19, 2013·4 cites·8 claims
- 0269US7863717B2Package structure of integrated circuit device and manufacturing method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Granted Jan 4, 2011·4 cites·20 claims
- 0368US8551794B2LED package and mold of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Oct 8, 2013·2 cites·12 claims
- 0465US8298861B2Package structure of compound semiconductor device and fabricating method thereofCHEN PIN CHUAN·Filed 2010·Granted Oct 30, 2012·2 cites·3 claims
- 0558US7893528B2Package structure of compound semiconductor device and fabricating method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Granted Feb 22, 2011·1 cites·1 claims
- 0653US8492790B2LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the sameLIN SHEN-BO·Filed 2011·Granted Jul 23, 2013·1 cites·18 claims
- 0752US2010059785A1Light emitting device and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 0846US2010090239A1Ceramic package structure of high power light emitting diode and manufacturing method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 0945US2009022198A1Package structure of compound semiconductor device and fabricating method thereofADVANCED OPTOELECTRONIC TECH·Filed 2008·Application pending·0 cites
- 1042US2012021541A1Light emitting device and method of fabricating the sameLIN SHEN BO·Filed 2011·Application pending·0 cites
- 1141US8436392B2Light emitting diode package and manufacturing method thereofCHANG CHAO-HSIUNG·Filed 2011·Granted May 7, 2013·0 cites·20 claims
- 1241US2011062474A1Light-emitting diode device and fabrication method thereofADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1337US2011031513A1Waterproof smd led module and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1435US2011215365A1Semiconductor package and fabrication method thereofADVANCED OPTOELECTRONIC TECH·Filed 2010·Application pending·0 cites
- 1534US2012025240A1Package of light emitting device and method of manufacturing the sameLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 1634US2012025238A1Led packageLIN SHEN-BO·Filed 2010·Application pending·0 cites
- 1733US8143080B2Method for manufacturing LED package and substrate thereofLIN SHEN-BO·Filed 2010·Granted Mar 27, 2012·0 cites·15 claims
- 1830US2012021542A1Method of packaging light emitting deviceLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 1930US2012012873A1Light emitting diode package for microminiaturizationLIN SHEN-BO·Filed 2011·Application pending·0 cites
- 2030US2012034716A1Method for manufacturing light emitting diodeLIN SHEN-BO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →