Inventor · disambiguated record
Sheng-Chi Lin
Also filed as: LIN SHENG C · LIN SHENG-CHI
14 granted patents·20 pending applications·242 citations·filing 1987–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8CLEARMIND BIOMEDICAL INC7TSAI YUAN-SONG4LIN SHENG-CHI3SEKOND CREATIVE DESIGN CO LTD2
Top patents by PatentIndex Score
34 records- 0191US9968249B2Endocranial endoscopeCLEARMIND BIOMEDICAL INC·Filed 2016·Granted May 15, 2018·19 cites·15 claims
- 0287US4760774AEspresso and drip coffee makerTSANN KUEN ENTERPRISE CO LTD·Filed 1987·Granted Aug 2, 1988·73 cites·4 claims
- 0385US12020896B2Insulator for an ion implantation sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 25, 2024·2 cites·20 claims
- 0485US11076755B2Endocranial endoscopeCLEARMIND BIOMEDICAL INC·Filed 2019·Granted Aug 3, 2021·6 cites·6 claims
- 0584US10441153B2Endocranial endoscopeCLEARMIND BIOMEDICAL INC·Filed 2018·Granted Oct 15, 2019·6 cites·15 claims
- 0683US12506116B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 0783US5052613ATwo-way envelopeLIN SHENG CHI·Filed 1990·Granted Oct 1, 1991·83 cites·20 claims
- 0882US7511988B2Static noise-immune SRAM cellsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 31, 2009·15 cites·16 claims
- 0977US2025349732A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1077US2025336901A1Packages including interconnect die embedded in package substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1176US2025349733A1Three-Dimensional Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1267US2024274405A1Insulator for an ion implantation sourceTAIWAN SEMICONDUCTOR MFG COMAPNY LTD·Filed 2024·Application pending·0 cites
- 1366US2023307375A1Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1465US2023307427A1Packages Including Interconnect Die Embedded in Package SubstratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1564US5516040ATwo way mailing envelopesFiled 1994·Granted May 14, 1996·36 cites·10 claims
- 1661US2025300053A1Semiconductor dies having electrical isolation layers and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1759US8790107B2Ice cream scoopLEE TUNG-HSIEN·Filed 2011·Granted Jul 29, 2014·1 cites·7 claims
- 1858US2024032783A1Endoscope deviceCLEARMIND BIOMEDICAL INC·Filed 2023·Application pending·0 cites
- 1955US11801337B2Medical deviceCLEARMIND BIOMEDICAL INC·Filed 2021·Granted Oct 31, 2023·0 cites·13 claims
- 2055US2009205506A1Bottle cap having filling functionLIN SHENG-CHI·Filed 2008·Application pending·0 cites
- 2154US2013133131A1Toilet seatPENG SHAO-YU·Filed 2012·Application pending·0 cites
- 2247US2022133138A1Dilator-less and obturator-less introducer for viewing and acting on internal passageways or tissueCLEARMIND BIOMEDICAL INC·Filed 2020·Application pending·0 cites
- 2347US2013001392A1Pad with Sucking DiscsLIN SHENG-CHI·Filed 2011·Application pending·0 cites
- 2444US9642490B2Food defrosting traySEKOND CREATIVE DESIGN CO LTD·Filed 2014·Granted May 9, 2017·0 cites·4 claims
- 2542US2018339245A1Device and method for detecting pollutants in waterUNIV NAT PINGTUNG SCI & TECH·Filed 2017·Application pending·0 cites
- 2642US2011268831A1Ice cream scoopINTERCONTINENTAL MARKETING SERVICES FAR EAST CO LTD·Filed 2010·Application pending·0 cites
- 2740US2016316978A1Toilet seatB-O-LANE COMFORTECH CO LTD·Filed 2016·Application pending·0 cites
- 2840US2013075554A1Suction Disc DeviceTSAI YUAN-SONG·Filed 2011·Application pending·0 cites
- 2940US2013075570A1Multi-Suction Disc DeviceTSAI YUAN-SONG·Filed 2011·Application pending·0 cites
- 3040US2013075563A1Suction DiscTSAI YUAN-SONG·Filed 2011·Application pending·0 cites
- 3138US9250288B2Wafer-level testing method for singulated 3D-stacked chip cubesPOWERTECH TECHNOLOGY INC·Filed 2013·Granted Feb 2, 2016·0 cites·5 claims
- 3238US2013186609A1Heating Pad Applicable to Induction CookerTSAI YUAN-SONG·Filed 2012·Application pending·0 cites
- 3335US2014001175A1Electromagnetic Frying and Broiling deviceSEKOND CREATIVE DESIGN CO LTD·Filed 2013·Application pending·0 cites
- 3433USD1080868SCannula for endoscopeCLEARMIND BIOMEDICAL INC·Filed 2022·Granted Jun 24, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →