Inventor · disambiguated record
Shun-Kuan Lin
Also filed as: LIN SHUN-KUAN
1 granted patent·2 pending applications·1 citations·filing 2022–2024
17Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0185US12191282B2Shared pad/bridge layout for a 3D ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 0273US2025070092A1Shared pad/bridge layout for a 3d icTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0351US2024153895A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →