Inventor · disambiguated record
Sheng-Feng Liu
Also filed as: LIU SHENG · LIU SHENG-FENG
17 granted patents·4 pending applications·75 citations·filing 1998–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0196US11288437B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·4 cites·20 claims
- 0294US11616124B2Method of making fin field effect transistor (FinFET) deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·2 cites·15 claims
- 0392US10867109B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·6 cites·20 claims
- 0492US10304772B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·7 cites·20 claims
- 0592US10032869B2Fin field effect transistor (FinFET) device having position-dependent heat generation and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·6 cites·18 claims
- 0690US11404369B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·5 cites·20 claims
- 0785US12438017B2Electromigration evaluation methodology with consideration of thermal and signal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0885US2024394462A1Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0982US12099792B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 1081US6247890B1Automatic goods picking deviceIND TECH RES INST·Filed 1998·Granted Jun 19, 2001·44 cites·8 claims
- 1180US12027391B2Electromigration evaluation methodology with consideration of thermal and signal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 1276US11687698B2Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·0 cites·20 claims
- 1375US12046638B2Fin field effect transistor (FinFET) device having position-dependent heat generationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·16 claims
- 1475US11901289B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 1573US11658049B2Electromigration evaluation methodology with consideration of thermal and signal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1664US11107714B2Electromigration evaluation methodology with consideration of thermal and signal effectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 1762US11107889B2Fin field effect transistor (FinFET) device having position-dependent heat generationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·0 cites·20 claims
- 1862US10576499B2Ultrasonic phased array probe using PCB as matching layerLIU SHENG·Filed 2017·Granted Mar 3, 2020·1 cites·22 claims
- 1940US2006249478A1Method for protecting a substrate with gold fingers in tin-welding processLIU SHENG-YUAN·Filed 2005·Application pending·0 cites
- 2036US2006179940A1Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level PackagingFINEMEMS INC·Filed 2005·Application pending·0 cites
- 2123US2001003939A1Automatic carton slitting machineFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →