Inventor · disambiguated record
Sheng-De Liu
Also filed as: LIU SHENG · Liu sheng-de
19 granted patents·1 pending application·81 citations·filing 2010–2023
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11TAIWAN SEMICONDUCTOR MFG4UNIV ARIZONA2HSU YI JANG1UNIV ARIZONA STATE1
Top patents by PatentIndex Score
20 records- 0197US11079596B23-dimensional electro-optical see-through displaysUNIV ARIZONA·Filed 2015·Granted Aug 3, 2021·40 cites·16 claims
- 0290US9503638B1High-resolution single-viewpoint panoramic camera and method of obtaining high-resolution panoramic images with a single viewpointUTOPIACOMPRESSION CORP·Filed 2014·Granted Nov 22, 2016·17 cites·20 claims
- 0389US8928120B1Wafer edge protection structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·8 cites·20 claims
- 0488US9601608B2Structure for a gallium nitride (GaN) high electron mobility transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·10 cites·20 claims
- 0582US9941398B2High-electron-mobility transistor (HEMT) capable of protecting a III-V compound layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·3 cites·9 claims
- 0681US12190768B1Method for ambient light detection, proximity sensing, and ambient light charging applied to display panelHSU YI JANG·Filed 2023·Granted Jan 7, 2025·1 cites·12 claims
- 0773US9911734B2Semiconductor device containing HEMT and MISFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·1 cites·20 claims
- 0868US11803059B23-dimensional electro-optical see-through displaysUNIV ARIZONA·Filed 2020·Granted Oct 31, 2023·0 cites·13 claims
- 0968US11233145B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 1063US9142614B2Isolation trench through backside of substrateTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·1 cites·20 claims
- 1162US10622471B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 1261US10325910B2Semiconductor device containing HEMT and MISFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·0 cites·20 claims
- 1357US10269948B2High-electron-mobility transistor (HEMT) structure capable of protecting a III-V compound layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·0 cites·31 claims
- 1457US9418901B2Semiconductor device containing HEMT and MISFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 16, 2016·0 cites·20 claims
- 1555US8912573B2Semiconductor device containing HEMT and MISFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 16, 2014·0 cites·20 claims
- 1654US10141438B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 27, 2018·0 cites·19 claims
- 1753US9530685B2Isolation trench through backside of substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·0 cites·21 claims
- 1851US9263569B2MISFET device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·0 cites·20 claims
- 1950US9748373B2MISFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·0 cites·20 claims
- 2050US2011075257A13-Dimensional electro-optical see-through displaysUNIV ARIZONA STATE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →