Inventor · disambiguated record
Shixi Louis Liu
Also filed as: LIU SHIXI LOUIS
21 granted patents·2 pending applications·152 citations·filing 2010–2024
94Inventor score
Top patents by PatentIndex Score
23 records- 0197US11768230B1Current sensor integrated circuit with a dual gauge lead frameALLEGRO MICROSYSTEMS LLC·Filed 2022·Granted Sep 26, 2023·7 cites·24 claims
- 0297US11519946B1Packaged current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2021·Granted Dec 6, 2022·13 cites·21 claims
- 0397US10345343B2Current sensor isolationALLEGRO MICROSYSTEMS LLC·Filed 2016·Granted Jul 9, 2019·24 cites·22 claims
- 0496US11150273B2Current sensor integrated circuitsALLEGRO MICROSYSTEMS LLC·Filed 2020·Granted Oct 19, 2021·10 cites·14 claims
- 0596US10753963B2Current sensor isolationALLEGRO MICROSYSTEMS LLC·Filed 2019·Granted Aug 25, 2020·14 cites·21 claims
- 0696US9865807B2Packaging for an electronic deviceALLEGRO MICROSYSTEMS LLC·Filed 2015·Granted Jan 9, 2018·16 cites·10 claims
- 0795US9190606B2Packaging for an electronic deviceLIU SHIXI LOUIS·Filed 2013·Granted Nov 17, 2015·29 cites·12 claims
- 0894US11644485B2Current sensor integrated circuitsALLEGRO MICROSYSTEMS LLC·Filed 2021·Granted May 9, 2023·3 cites·17 claims
- 0994US10049969B1Integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2017·Granted Aug 14, 2018·14 cites·37 claims
- 1091US11289406B2Signal isolator having enhanced creepage characteristicsALLEGRO MICROSYSTEMS LLC·Filed 2019·Granted Mar 29, 2022·5 cites·14 claims
- 1189US11973008B2Signal isolator having enhanced creepage characteristicsALLEGRO MICROSYSTEMS LLC·Filed 2022·Granted Apr 30, 2024·1 cites·10 claims
- 1289US11183436B2Power module package and packaging techniquesALLEGRO MICROSYSTEMS LLC·Filed 2020·Granted Nov 23, 2021·3 cites·42 claims
- 1385US11519939B2Current sensor integrated circuitsALLEGRO MICROSYSTEMS LLC·Filed 2021·Granted Dec 6, 2022·1 cites·8 claims
- 1482US12183662B2Signal isolator having enhanced creepage characteristicsALLEGRO MICROSYSTEMS LLC·Filed 2024·Granted Dec 31, 2024·0 cites·12 claims
- 1577US8718720B1Die including a groove extending from a via to an edge of the dieLIU SHIXI LOUIS·Filed 2010·Granted May 6, 2014·5 cites·14 claims
- 1675US12493057B2Current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·30 claims
- 1760US12282075B2Sensor package and systemALLEGRO MICROSYSTEMS LLC·Filed 2022·Granted Apr 22, 2025·0 cites·19 claims
- 1859US12487254B2Packaged current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2023·Granted Dec 2, 2025·0 cites·19 claims
- 1959US2024047314A1Packaged current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 2058US2025062198A1Dual semiconductor die current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2023·Application pending·0 cites
- 2155US12163983B2Packaged current sensor integrated circuitALLEGRO MICROSYSTEMS LLC·Filed 2022·Granted Dec 10, 2024·0 cites·24 claims
- 2252US9190384B2Preform including a groove extending to an edge of the preformTRIQUINT SEMICONDUCTOR INC·Filed 2014·Granted Nov 17, 2015·0 cites·12 claims
- 2349USD719115SHousing for an electronic deviceLIU SHIXI LOUIS·Filed 2013·Granted Dec 9, 2014·7 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →