Inventor · disambiguated record
Shin S. Low
Also filed as: LOW SHIN S · LOW SHIN SHERN
2 granted patents·1 pending application·14 citations·filing 2002–2017
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US10840192B1Stacked silicon package assembly having enhanced stiffenerXILINX INC·Filed 2017·Granted Nov 17, 2020·12 cites·21 claims
- 0258US8536717B2Integrated circuit package and method of assembling an integrated circuit packageLOW SHIN S·Filed 2012·Granted Sep 17, 2013·2 cites·20 claims
- 0328US2004021213A1Thermally-enhanced integrated circuit packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →