Inventor · disambiguated record
Shuying Ma
Also filed as: MA SHUYING
1 granted patent·1 pending application·0 citations·filing 2022–2024
3Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0144US2024332240A1Panel-level package structure and method for preparing the sameJIANGSU PANGU SEMICONDUCTOR TECH CO LTD·Filed 2024·Application pending·0 cites
- 0239US12506119B2System-on-chip integrated packaging structure, having a chip embedded in a recess, manufacturing method therefor and three-dimensional stacked deviceHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →