Inventor · disambiguated record
Shota Miki
Also filed as: MIKI SHOTA
10 granted patents·4 pending applications·26 citations·filing 2014–2023
83Inventor score
Top patents by PatentIndex Score
14 records- 0190US9825006B2Electronic component device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2016·Granted Nov 21, 2017·10 cites·24 claims
- 0286US10485098B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Nov 19, 2019·7 cites·4 claims
- 0383US10340200B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 2, 2019·5 cites·6 claims
- 0470US9953958B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 24, 2018·2 cites·11 claims
- 0569US11233001B2Adhesive layer bonding a plurality of substrates having a fillet raised portionSHINKO ELECTRIC IND CO·Filed 2019·Granted Jan 25, 2022·1 cites·14 claims
- 0663US9633978B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 25, 2017·1 cites·20 claims
- 0762US12482734B2Laminated wiring boardSHINKO ELECTRIC IND CO·Filed 2023·Granted Nov 25, 2025·0 cites·17 claims
- 0859US12317426B2Laminated wiring boardSHINKO ELECTRIC IND CO·Filed 2023·Granted May 27, 2025·0 cites·12 claims
- 0955US2023174696A1Acrylic copoymer, acrylic copoymer-containing composition and crosslinked product of sameOSAKA SODA CO LTD·Filed 2021·Application pending·0 cites
- 1054US11706877B2Composite wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Jul 18, 2023·0 cites·14 claims
- 1152US2023230911A1Wiring substrate, semiconductor device, and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2023·Application pending·0 cites
- 1251US10959328B2Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2020·Granted Mar 23, 2021·0 cites·8 claims
- 1351US2022356283A1Acrylic emulsionOSAKA SODA CO LTD·Filed 2020·Application pending·0 cites
- 1433US2017025386A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →