Inventor · disambiguated record
Shoma Miyata
Also filed as: MIYATA SHOMA
3 granted patents·7 pending applications·1 citations·filing 2021–2025
53Inventor score
Technology areasH10P
Files withKOKUSAI ELECTRIC CORP10
Top patents by PatentIndex Score
10 records- 0186US11923191B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 0283US2025336670A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0381US12374544B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0480US2025391678A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0571US12424463B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 0659US2025112063A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0759US2025104998A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0856US2024112907A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0956US2024030026A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1054US2024096617A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →