Inventor · disambiguated record
Shinji Miyazawa
Also filed as: MIYAZAWA SHINJI
32 granted patents·6 pending applications·88 citations·filing 2009–2024
96Inventor score
Files withSONY CORP24SONY GROUP CORP7SONY SEMICONDUCTOR SOLUTIONS CORP4HIRAI KIYOSHI1MIYAZAWA SHINJI1
Top patents by PatentIndex Score
38 records- 0197US11594563B2Image sensor having improved dicing propertiesSONY CORP·Filed 2021·Granted Feb 28, 2023·3 cites·16 claims
- 0295US10923517B2Solid-state imaging apparatus having output circuit unit for outputting a pixel signalSONY CORP·Filed 2020·Granted Feb 16, 2021·3 cites·10 claims
- 0394US10756130B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2018·Granted Aug 25, 2020·3 cites·20 claims
- 0493US9991301B2Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the sameSONY CORP·Filed 2015·Granted Jun 5, 2018·8 cites·20 claims
- 0592US10321079B2Solid-state imaging apparatus having multiple structures to reduce the apparatus size, manufacturing method of the same, and electronic deviceSONY CORP·Filed 2016·Granted Jun 11, 2019·7 cites·20 claims
- 0692US10038021B2Packaged image sensor having improved dicing propertiesSONY CORP·Filed 2017·Granted Jul 31, 2018·6 cites·14 claims
- 0792US9941318B2Semiconductor device and electronic apparatus including an organic material layer between a dummy lens and a transparent substrateSONY CORP·Filed 2017·Granted Apr 10, 2018·5 cites·28 claims
- 0891US10236315B2Solid-state image pickup element, image pickup apparatus, electronic apparatus, and production methodSONY CORP·Filed 2014·Granted Mar 19, 2019·8 cites·15 claims
- 0990US10608028B2Image sensor having improved dicing propertiesSONY CORP·Filed 2018·Granted Mar 31, 2020·4 cites·15 claims
- 1090US10332924B2Package and electronic apparatus including a package having a microlens layer and color filter layerSONY CORP·Filed 2018·Granted Jun 25, 2019·4 cites·20 claims
- 1190US2024371896A1Solid-state image sensor and electronic deviceSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 1289US11024658B2Image sensor including groovesSONY CORP·Filed 2020·Granted Jun 1, 2021·2 cites·20 claims
- 1387US10032816B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2016·Granted Jul 24, 2018·3 cites·16 claims
- 1487US9257474B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2013·Granted Feb 9, 2016·2 cites·19 claims
- 1585US12068346B2Solid-state image sensor and electronic deviceSONY GROUP CORP·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1685US11973091B2Solid-state imaging apparatus having output circuit unit for outputting a pixel signalSONY CORP·Filed 2021·Granted Apr 30, 2024·1 cites·17 claims
- 1785US11037975B2Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrateSONY CORP·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 1885US9929197B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2017·Granted Mar 27, 2018·2 cites·30 claims
- 1984US9812479B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2017·Granted Nov 7, 2017·2 cites·30 claims
- 2084US9728568B2Semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 8, 2017·3 cites·16 claims
- 2183US10777598B2Image pickup device and electronic apparatusSONY CORP·Filed 2017·Granted Sep 15, 2020·3 cites·20 claims
- 2281US10748947B2Imaging device, manufacturing method, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Aug 18, 2020·4 cites·18 claims
- 2381US2024290801A1Solid-state imaging apparatus having output circuit unit for outputting a pixel signalSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 2480US9059062B2Solid-state imaging device, method of manufacturing the same, and electronic apparatusYORIKADO YUHI·Filed 2010·Granted Jun 16, 2015·7 cites·21 claims
- 2576US12166060B2Image pickup device and electronic apparatusSONY GROUP CORP·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 2676US11600648B2Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrateSONY GROUP CORP·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2775US11991468B2Solid-state imaging apparatus, manufacturing method of the same, and electronic deviceSONY GROUP CORP·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2875US11581346B2Solid-state image sensor and electronic deviceSONY CORP·Filed 2020·Granted Feb 14, 2023·0 cites·19 claims
- 2975US2023178575A1Semiconductor device and electronic apparatusSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 3074US10672809B2Solid-state imaging apparatus having output circuit unit for outputting pixel signalSONY CORP·Filed 2017·Granted Jun 2, 2020·1 cites·7 claims
- 3174US8593554B2Solid-state imaging apparatus, camera, and method of manufacturing solid-state imaging apparatusMIYAZAWA SHINJI·Filed 2009·Granted Nov 26, 2013·5 cites·14 claims
- 3269US11508773B2Image pickup device and electronic apparatusSONY CORP·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 3361US11438540B2Solid-state imaging apparatus, manufacturing method of the same, and electronic deviceSONY CORP·Filed 2019·Granted Sep 6, 2022·0 cites·19 claims
- 3451US8007962B2PhotomaskSONY CORP·Filed 2009·Granted Aug 30, 2011·0 cites·7 claims
- 3551US2024363663A1Sensor device and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3648US9314737B2Dehumidifier and method for producing dehumidifierHIRAI KIYOSHI·Filed 2012·Granted Apr 19, 2016·0 cites·5 claims
- 3735US2017234992A1Imaging apparatus and manufacturing method thereofSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Application pending·0 cites
- 3834US2017234995A1Solid-state image sensor, manufacturing method, and radiation imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shinji Miyazawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →