Inventor · disambiguated record
Shahriar Moinian
Also filed as: MOINIAN SHAHRIAR
10 granted patents·1 pending application·76 citations·filing 1999–2011
87Inventor score
Top patents by PatentIndex Score
11 records- 0180US7847666B2Differential inductor for use in integrated circuitsAGERE SYSTEMS INC·Filed 2006·Granted Dec 7, 2010·12 cites·21 claims
- 0272US7480874B2Reliability analysis of integrated circuitsAGERE SYSTEMS INC·Filed 2005·Granted Jan 20, 2009·9 cites·21 claims
- 0366US7174532B2Method of making a semiconductor device by balancing shallow trench isolation stress and optical proximity effectsAGERE SYSTEMS INC·Filed 2004·Granted Feb 6, 2007·14 cites·19 claims
- 0466US6825089B1Increased quality factor of a varactor in an integrated circuit via a high conductive region in a wellAGERE SYSTEMS INC·Filed 2003·Granted Nov 30, 2004·12 cites·8 claims
- 0558US8283713B2Logic-based eDRAM using local interconnects to reduce impact of extension contact parasiticsJANSEN JOHN G·Filed 2011·Granted Oct 9, 2012·3 cites·22 claims
- 0656US6395611B1Inductor or low loss interconnect and a method of manufacturing an inductor or low loss interconnect in an integrated circuitAGERE SYST GUARDIAN CORP·Filed 1999·Granted May 28, 2002·21 cites·12 claims
- 0750US8464202B2Fully parameterizable representation of a higher level design entityBOSHART SHAWN·Filed 2011·Granted Jun 11, 2013·1 cites·18 claims
- 0850US7345354B2Increased quality factor of a varactor in an integrated circuit via a high conductive region in a wellAGERE SYSTEMS INC·Filed 2004·Granted Mar 18, 2008·4 cites·6 claims
- 0940US8143696B2Integrated circuit inductors with reduced magnetic couplingMAO WEIWEI·Filed 2009·Granted Mar 27, 2012·0 cites·20 claims
- 1035US2010244276A1Three-dimensional electronics packageLSI CORP·Filed 2010·Application pending·0 cites
- 1133US6657281B1Bipolar transistor with a low K material in emitter base spacer regionsAGERE SYSTEMS INC·Filed 2000·Granted Dec 2, 2003·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →