Inventor · disambiguated record
Shyama Mukherjee
Also filed as: MUKHERJEE SHYAMA · MUKHERJEE SHYAMA P
19 granted patents·6 pending applications·1,211 citations·filing 1989–2008
96Inventor score
Top patents by PatentIndex Score
25 records- 0199US5919587AComposite cathodes, electrochemical cells comprising novel composite cathodes, and processes for fabricating sameMOLTECH CORP·Filed 1997·Granted Jul 6, 1999·287 cites·51 claims
- 0297US7939198B2Composite cathodes, electrochemical cells comprising novel composite cathodes, and processes for fabricating sameSION POWER CORP·Filed 2001·Granted May 10, 2011·79 cites·1 claims
- 0397US5380560APalladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal depositionIBM·Filed 1992·Granted Jan 10, 1995·327 cites·20 claims
- 0495US6238821B1Composite cathodes, electrochemical cells comprising novel composite cathodes, and processes for fabricating sameMOLTECH CORP·Filed 1999·Granted May 29, 2001·112 cites·32 claims
- 0594US6444715B1Low dielectric materials and methods of producing sameHONEYWELL INT INC·Filed 2000·Granted Sep 3, 2002·77 cites·12 claims
- 0692US7790315B2Composite cathodes, electrochemical cells comprising novel composite cathodes, and processes for fabricating sameSION POWER CORP·Filed 2006·Granted Sep 7, 2010·9 cites·66 claims
- 0792US6600229B2Planarizers for spin etch planarization of electronic componentsHONEYWELL INT INC·Filed 2001·Granted Jul 29, 2003·76 cites·11 claims
- 0892US6406814B1Method of forming cathodes comprising electroactive sulfur materialsMOLTECH CORP·Filed 2000·Granted Jun 18, 2002·41 cites·43 claims
- 0987US6630433B2Composition for chemical mechanical planarization of copper, tantalum and tantalum nitrideHONEYWELL INT INC·Filed 2000·Granted Oct 7, 2003·39 cites·8 claims
- 1080US5120339AMethod for fabricating a low thermal expansion coefficient glass fiber-reinforced polymer matrix composite substrate and composite substrateIBM·Filed 1991·Granted Jun 9, 1992·47 cites·18 claims
- 1175US7011889B2OrganosiloxanesHONEYWELL INT INC·Filed 2002·Granted Mar 14, 2006·9 cites·37 claims
- 1273US6962727B2OrganosiloxanesHONEYWELL INT INC·Filed 2002·Granted Nov 8, 2005·10 cites·19 claims
- 1372US8481106B2High-dielectric constant thin film metal oxides on silicon wafers for capacitor applications and methods of manufactureMUKHERJEE SHYAMA P·Filed 2008·Granted Jul 9, 2013·6 cites·12 claims
- 1469US6787198B2Hydrothermal treatment of nanostructured filmsEKC TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·14 cites·21 claims
- 1566US6890641B1Low dielectric materials and methods of producing sameHONEYWELL INT INC·Filed 2003·Granted May 10, 2005·8 cites·11 claims
- 1666US5462897AMethod for forming a thin film layerIBM·Filed 1993·Granted Oct 31, 1995·39 cites·11 claims
- 1765US6627669B2Low dielectric materials and methods of producing sameHONEYWELL INT INC·Filed 2002·Granted Sep 30, 2003·8 cites·18 claims
- 1864US6696358B2Viscous protective overlayers for planarization of integrated circuitsHONEYWELL INT INC·Filed 2001·Granted Feb 24, 2004·8 cites·6 claims
- 1961US4988646AMethod for producing a ceramicIBM·Filed 1989·Granted Jan 29, 1991·15 cites·17 claims
- 2054US2005175895A1Cathodes comprising electroactive sulfur materials and secondary batteries using sameFiled 2005·Application pending·0 cites
- 2152US2005196672A1Novel composite cathodes, eletrochemical cells comprising novel composite cathodes, and processes for fabricating sameFiled 2004·Application pending·0 cites
- 2239US2004192052A1Viscous protective overlayers for planarization of integrated circuitsFiled 2003·Application pending·0 cites
- 2339US2004046148A1Composition for chemical mechanical planarization of copper, tantalum and tantalum nitrideFiled 2003·Application pending·0 cites
- 2438US2004176488A1Low dielectric materials and methods of producing sameFiled 2003·Application pending·0 cites
- 2537US2004124438A1Planarizers for spin etch planarization of electronic components and methods of use thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →