Inventor · disambiguated record
Shinji Muraki
Also filed as: MURAKI SHINJI
2 granted patents·1 pending application·0 citations·filing 2004–2009
27Inventor score
Technology areasH10W
Files withOKI SEMICONDUCTOR CO LTD2
Top patents by PatentIndex Score
3 records- 0138US7883655B2Molding apparatus for manufacturing a semiconductor device and method using the sameOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Feb 8, 2011·0 cites·8 claims
- 0235US7621732B2Molding apparatus for manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Nov 24, 2009·0 cites·4 claims
- 0328US2005172891A1Dies bonding apparatus and dies bonding methodFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →