Inventor · disambiguated record
Shin Nakao
Also filed as: NAKAO SHIN · NAKAO SHIN-ICHI
11 granted patents·1 pending application·593 citations·filing 1983–2003
93Inventor score
Top patents by PatentIndex Score
12 records- 0197US4561011ADimensionally stable semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Dec 24, 1985·136 cites·5 claims
- 0295US5656863AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 12, 1997·183 cites·24 claims
- 0386US6191493B1Resin seal semiconductor package and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 20, 2001·67 cites·6 claims
- 0482US7135230B2Functional particle and preparing/plasma-treating method of the sameREIKA KOGYO KABUSHIKI KAISHA·Filed 2003·Granted Nov 14, 2006·21 cites·13 claims
- 0579US6866831B2Reaction and stirring apparatus, reaction and separating filtration apparatus and separating method, generation method, and filtration methodREIKA KOGYO KABUSHIKI KAISHA·Filed 2000·Granted Mar 15, 2005·26 cites·36 claims
- 0679US4654966AMethod of making a dimensionally stable semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Apr 7, 1987·48 cites·6 claims
- 0769US5753973AResin seal semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1997·Granted May 19, 1998·28 cites·25 claims
- 0863US5016084ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted May 14, 1991·33 cites·15 claims
- 0962US5366794ATape carrier for semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Nov 22, 1994·35 cites·4 claims
- 1057US7824820B2Electrolyte film and solid polymer fuel cell using the sameNITTO DENKO CORP·Filed 2003·Granted Nov 2, 2010·3 cites·10 claims
- 1152US5920770AResin seal semiconductor package and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jul 6, 1999·13 cites·27 claims
- 1242US2005118479A1Electrolyte film and solid polymer fuel cell using the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →