Inventor · disambiguated record
Shinya Nakaseko
Also filed as: NAKASEKO SHINYA
6 granted patents·3 pending applications·346 citations·filing 1994–2003
87Inventor score
Top patents by PatentIndex Score
9 records- 0189US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 0287US5679978ASemiconductor device having resin gate hole through substrate for resin encapsulationFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·96 cites·15 claims
- 0386US6541848B2Semiconductor device including stud bumps as external connection terminalsFUJITSU LTD·Filed 1998·Granted Apr 1, 2003·58 cites·9 claims
- 0473US5844309AAdhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the compositionFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·46 cites·14 claims
- 0548US5804467ASemiconductor device and method of producing the sameFUJISTSU LIMITED·Filed 1997·Granted Sep 8, 1998·15 cites·12 claims
- 0640US6034428ASemiconductor integrated circuit device having stacked wiring and insulating layersFUJITSU LTD·Filed 1996·Granted Mar 7, 2000·9 cites·7 claims
- 0740US2003132533A1Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 0832US2002127776A1Semiconductor device having an organic material layer and method for making the sameFUJITSU LTD·Filed 2001·Application pending·0 cites
- 0928US2001045643A1Semiconductor device keeping structural integrity under heat-generated stressFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →