Inventor · disambiguated record
Shoriki Narita
Also filed as: NARITA SHORIKI
28 granted patents·3 pending applications·566 citations·filing 1995–2009
97Inventor score
Top patents by PatentIndex Score
31 records- 0197US7797820B2Component mounting apparatusPANASONIC CORP·Filed 2008·Granted Sep 21, 2010·178 cites·7 claims
- 0296US7353596B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 8, 2008·180 cites·4 claims
- 0386US7650691B2Component supply head device and component mounting head devicePANASONIC CORP·Filed 2005·Granted Jan 26, 2010·10 cites·3 claims
- 0477US7014092B2Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 21, 2006·16 cites·9 claims
- 0576US6302317B1Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 16, 2001·28 cites·6 claims
- 0673US7806642B2Receiver for component feed plates and component feederPANASONIC CORP·Filed 2005·Granted Oct 5, 2010·4 cites·21 claims
- 0772US6329640B1Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 11, 2001·13 cites·16 claims
- 0869US7516878B2Bump formation method and bump forming apparatus for semiconductor waferPANASONIC CORP·Filed 2005·Granted Apr 14, 2009·2 cites·6 claims
- 0969US6494358B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 17, 2002·10 cites·7 claims
- 1066US7452315B2Tool exchange device and toolPANASONIC CORP·Filed 2007·Granted Nov 18, 2008·2 cites·2 claims
- 1165US5769236AComponent collective and component collective feeding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 23, 1998·22 cites·19 claims
- 1263US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 1360US7731469B2Component feederPANASONIC CORP·Filed 2003·Granted Jun 8, 2010·7 cites·27 claims
- 1460US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 1560US6568580B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·6 cites·2 claims
- 1659US7052984B2Bump formation method and bump forming apparatus for semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·6 cites·24 claims
- 1758US7350289B2Component feeding head apparatus, for holding a component arrayedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Apr 1, 2008·9 cites·12 claims
- 1856US7387229B2Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 17, 2008·4 cites·7 claims
- 1956US6098868ABump forming method and bump bonderMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 8, 2000·23 cites·2 claims
- 2056US2010064510A1Component supply head device and component mounting head deviceNARITA SHORIKI·Filed 2009·Application pending·0 cites
- 2154US7005368B1Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 28, 2006·3 cites·8 claims
- 2254US2008179378A1Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeIMANISHI MAKOTO·Filed 2007·Application pending·0 cites
- 2353US6392202B2Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 21, 2002·3 cites·4 claims
- 2451US5955876ABoard positioning apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Sep 21, 1999·14 cites·23 claims
- 2549US7306551B2Tool exchange device and toolMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 11, 2007·2 cites·6 claims
- 2647US7031509B2Method and apparatus for correcting inclination of IC on semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 18, 2006·2 cites·15 claims
- 2745US2008141526A1Method for moving a mounting head unitNARITA SHORIKI·Filed 2008·Application pending·0 cites
- 2842US5648729ABoard positioning method and apparatus of the methodsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 15, 1997·9 cites·4 claims
- 2940US6818975B1Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 16, 2004·0 cites·29 claims
- 3039US7552528B2Wafer expanding device, component feeder, and expanding method for wafer sheetPANASONIC CORP·Filed 2005·Granted Jun 30, 2009·0 cites·10 claims
- 3134US6787391B1Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 7, 2004·3 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →