Inventor · disambiguated record
Shimon Neftin
Also filed as: NEFTIN SHIMON
4 granted patents·8 pending applications·154 citations·filing 1995–2012
77Inventor score
Top patents by PatentIndex Score
12 records- 0184US6448510B1Substrate for electronic packaging, pin jig fixtureMICRO COMPONENTS LTD·Filed 1999·Granted Sep 10, 2002·121 cites·19 claims
- 0252US6670704B1Device for electronic packaging, pin jig fixtureMICRO COMPONENTS LTD·Filed 1999·Granted Dec 30, 2003·19 cites·32 claims
- 0351US2010252306A1Interconnect substrates, methods and systems thereofMICRO COMPONENTS LTD·Filed 2008·Application pending·0 cites
- 0450US2010255274A1Deep anodizationMIRSKY URI·Filed 2008·Application pending·0 cites
- 0542US2007080360A1Microelectronic interconnect substrate and packaging techniquesMIRSKY URL·Filed 2006·Application pending·0 cites
- 0640US2012112238A1Microelectronic interconnect substrate and packaging techniquesMIRSKY URI·Filed 2011·Application pending·0 cites
- 0738US5661341AMethod of manufacturing a composite structure for use in electronic devices and structure, manufactured by said methodMICROCOMPONENTS AND SYSTEMS LT·Filed 1995·Granted Aug 26, 1997·14 cites·5 claims
- 0837US2007126111A1Microelectronic packaging and componentsMIRSKY URI·Filed 2006·Application pending·0 cites
- 0937US2010078329A1Optically monitoring an alox fabrication processMIRSKY URI·Filed 2007·Application pending·0 cites
- 1033US2012273963A1Microelectronic interconnect substrate and packaging techniquesMIRSKY URI·Filed 2012·Application pending·0 cites
- 1132US2006057866A1Microelectronic packaging and componentsMIRSKY URI·Filed 2003·Application pending·0 cites
- 1231US9631791B2Integrated interconnect and reflectorNEFTIN SHIMON·Filed 2012·Granted Apr 25, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →