Inventor · disambiguated record
Shuji Nomoto
Also filed as: NOMOTO SHUJI
2 granted patents·7 pending applications·2 citations·filing 2019–2023
35Inventor score
Top patents by PatentIndex Score
9 records- 0182US12103999B2Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 1, 2024·2 cites·19 claims
- 0254US2025271758A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0353US2025116930A1Photosensitive resin composition, photosensitive element, printed circuit board, and method for manufacturing printed circuit boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0447US12498636B2Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·19 claims
- 0545US2024134277A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0645US2024160103A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0745US2022179308A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0843US2023221638A1Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 0939US2022155681A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →