Inventor · disambiguated record
Shuichi Ogata
Also filed as: OGATA SHUICHI
5 granted patents·4 pending applications·30 citations·filing 2000–2024
76Inventor score
Technology areasH10W
Files withPANASONIC CORP3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2NUVOTON TECHNOLOGY CORP JAPAN2KAWAI FUMIHIKO1
Top patents by PatentIndex Score
9 records- 0166US7952177B2Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die padsPANASONIC CORP·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 0264US6633077B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 14, 2003·12 cites·13 claims
- 0363US7508055B2High heat release semiconductor and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Mar 24, 2009·4 cites·23 claims
- 0462US2024377851A1Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2024·Application pending·0 cites
- 0561US2025079370A1Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2024·Application pending·0 cites
- 0655US8193091B2Resin encapsulated semiconductor device and method for manufacturing the sameKAWAI FUMIHIKO·Filed 2002·Granted Jun 5, 2012·10 cites·20 claims
- 0741US2006097371A1Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die padsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 0833US2001015482A1Semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 0927USD600219SLead framePANASONIC CORP·Filed 2006·Granted Sep 15, 2009·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →