Inventor · disambiguated record
Shingo Ogawa
Also filed as: OGAWA SHINGO
8 granted patents·5 pending applications·131 citations·filing 1983–2025
85Inventor score
Files withNEC CORP5FUJIFILM CORP2DAINICHISEIKA COLOR & CHEMICALS MFC CO LTD1DAINICHISEIKA COLOR CHEM1HIROSE ELECTRIC CO LTD1
Top patents by PatentIndex Score
13 records- 0192US11410462B2Processing system and processing methodNEC CORP·Filed 2020·Granted Aug 9, 2022·4 cites·15 claims
- 0292US6340320B1Probe pin assembly, a method of making the same and a connector using the sameHONDA TSUSHIN KOGYO CO LTD·Filed 1999·Granted Jan 22, 2002·95 cites·2 claims
- 0379US12373531B2Processing system and processing methodNEC CORP·Filed 2024·Granted Jul 29, 2025·0 cites·19 claims
- 0477US7711147B2Time-to-contact estimation device and method for estimating time to contactHONDA MOTOR CO LTD·Filed 2006·Granted May 4, 2010·10 cites·8 claims
- 0577US2025322053A1Processing system and processing methodNEC CORP·Filed 2025·Application pending·0 cites
- 0669US6689303B2Injection molding method using a stacked moldYAMATAKE CORP·Filed 2002·Granted Feb 10, 2004·11 cites·2 claims
- 0769US2025169480A1Biodegradable artificial bait composition and biodegradable artificial baitDAINICHISEIKA COLOR CHEM·Filed 2023·Application pending·0 cites
- 0863US12039022B2Processing system and processing methodNEC CORP·Filed 2020·Granted Jul 16, 2024·0 cites·11 claims
- 0956US2024405405A1Imaging apparatusFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 1053US2025008218A1Imaging apparatusFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 1152US11244149B2Processing apparatus, processing method, and non-transitory storage mediumNEC CORP·Filed 2020·Granted Feb 8, 2022·0 cites·8 claims
- 1244US2022008154A1Surgical drapeDAINICHISEIKA COLOR & CHEMICALS MFC CO LTD·Filed 2019·Application pending·0 cites
- 1343US4584766AApparatus for connection of multicore cableHIROSE ELECTRIC CO LTD·Filed 1983·Granted Apr 29, 1986·11 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →