Inventor · disambiguated record
Shinichi Ohizumi
Also filed as: OHIZUMI SHINICHI
5 granted patents·180 citations·filing 1995–1999
84Inventor score
Technology areasH10W
Files withNITTO DENKO CORP5
Top patents by PatentIndex Score
5 records- 0182US5846477AProduction method for encapsulating a semiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Dec 8, 1998·78 cites·10 claims
- 0277US6144108ASemiconductor device and method of fabricating the sameNITTO DENKO CORP·Filed 1997·Granted Nov 7, 2000·55 cites·11 claims
- 0363US5834850AEncapsulated semiconductor device having metal foil covering, and metal foilNITTO DENKO CORP·Filed 1996·Granted Nov 10, 1998·26 cites·13 claims
- 0452US5904505AProcess for producing encapsulated semiconductor device having metal foil material covering and metal foilNITTO DENKO CORP·Filed 1997·Granted May 18, 1999·16 cites·1 claims
- 0533US6410615B1Semiconductor sealing epoxy resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 1999·Granted Jun 25, 2002·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →