Inventor · disambiguated record
Shinya Ohkawa
Also filed as: OHKAWA SHINYA
3 granted patents·2 pending applications·17 citations·filing 2005–2025
63Inventor score
Top patents by PatentIndex Score
5 records- 0175US7777353B2Semiconductor device and wire bonding method thereforYAMAHA CORP·Filed 2007·Granted Aug 17, 2010·11 cites·3 claims
- 0272US7551678B2OFDM transceiver apparatusFUJITSU LTD·Filed 2005·Granted Jun 23, 2009·6 cites·3 claims
- 0356US2025076883A1Mobility service systemTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0446US2025317606A1Remote support systemTOYOTA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0540US7701043B2Lead frameYAMAHA CORP·Filed 2007·Granted Apr 20, 2010·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →