Inventor · disambiguated record
Shuichi Oka
Also filed as: OKA SHUICHI
25 granted patents·6 pending applications·103 citations·filing 2002–2022
94Inventor score
Top patents by PatentIndex Score
31 records- 0185US10410884B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2017·Granted Sep 10, 2019·4 cites·20 claims
- 0285US8254144B2Circuit board laminated module and electronic equipmentMATSUMOTO KATSUJI·Filed 2010·Granted Aug 28, 2012·14 cites·8 claims
- 0384US8482107B2Circular shield of a circuit-substrate laminated module and electronic apparatusROKUHARA SHINJI·Filed 2010·Granted Jul 9, 2013·10 cites·15 claims
- 0480US9929199B2Radiation detector, imaging unit, and imaging and display systemSONY CORP·Filed 2014·Granted Mar 27, 2018·5 cites·17 claims
- 0577US6960790B2Fingerprint detection device and method of its manufacture, and apparatus for forming a protective filmSONY CORP·Filed 2002·Granted Nov 1, 2005·32 cites·9 claims
- 0676US8331103B2Wiring board, method of manufacturing same, tuner module, and electronic deviceOKA SHUICHI·Filed 2010·Granted Dec 11, 2012·4 cites·7 claims
- 0774US9257395B2Semiconductor deviceSONY CORP·Filed 2014·Granted Feb 9, 2016·3 cites·11 claims
- 0873US10134662B2Mounting substrate and method of manufacturing the sameSONY CORP·Filed 2015·Granted Nov 20, 2018·2 cites·5 claims
- 0973US10109571B2Wiring substrate and manufacturing method of wiring substrateFUJITSU LTD·Filed 2016·Granted Oct 23, 2018·2 cites·10 claims
- 1071US7629200B2Fingerprint detection device and method of its manufacture, and apparatus for forming a protective filmSONY CORP·Filed 2007·Granted Dec 8, 2009·7 cites·6 claims
- 1170US9723724B2Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrateSONY CORP·Filed 2014·Granted Aug 1, 2017·2 cites·8 claims
- 1270US7889027B2Film bulk acoustic resonator shaped as an ellipse with a part cut offSONY CORP·Filed 2006·Granted Feb 15, 2011·7 cites·10 claims
- 1361US10634862B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2018·Granted Apr 28, 2020·0 cites·15 claims
- 1461US7235853B2Fingerprint detection device and method of its manufacture, and apparatus for forming a protective filmSONY CORP·Filed 2005·Granted Jun 26, 2007·3 cites·9 claims
- 1560US10483413B2Photoelectric module and optical deviceSONY CORP·Filed 2015·Granted Nov 19, 2019·1 cites·16 claims
- 1659US8338912B2Inductor module, silicon tuner module and semiconductor deviceOKA SHUICHI·Filed 2009·Granted Dec 25, 2012·2 cites·3 claims
- 1758US9614347B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2014·Granted Apr 4, 2017·0 cites·15 claims
- 1857US10168498B2Optical communication device, reception apparatus, transmission apparatus, and transmission and reception systemSONY CORP·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 1956US12354923B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jul 8, 2025·0 cites·16 claims
- 2053US12456669B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Oct 28, 2025·0 cites·44 claims
- 2153US12074185B2Semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Aug 27, 2024·0 cites·17 claims
- 2253US11984639B2Antenna device and wireless communication apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted May 14, 2024·0 cites·14 claims
- 2353US2024145901A1Semiconductor device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2450US2024145506A1Semiconductor package and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2548US7250774B2Fingerprint sensorSONY CORP·Filed 2002·Granted Jul 31, 2007·5 cites·4 claims
- 2646US2013149464A1Method of manufacturing circuit boardSONY CORP·Filed 2012·Application pending·0 cites
- 2744US10830972B2Optical connector, electronic apparatus and optical interconnection systemSONY CORP·Filed 2016·Granted Nov 10, 2020·0 cites·20 claims
- 2839US9672983B2Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereofOKA SHUICHI·Filed 2012·Granted Jun 6, 2017·0 cites·6 claims
- 2939US2007247268A1Inductor element and method for production thereof, and semiconductor module with inductor elementOYA YOICHI·Filed 2007·Application pending·0 cites
- 3035US2012241204A1Thin film capacitor, mounting substrate, and method of manufacturing the mounting substrateMATSUMOTO KATSUJI·Filed 2012·Application pending·0 cites
- 3133US2005269904A1Thin film bulk acoustic resonator and method of manufacturing the sameOKA SHUICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →