Inventor · disambiguated record
Shogo Onishi
Also filed as: ONISHI SHOGO
17 granted patents·18 pending applications·25 citations·filing 2012–2025
88Inventor score
Top patents by PatentIndex Score
35 records- 0188US9486892B2Polishing compositionFUJIMI INC·Filed 2013·Granted Nov 8, 2016·13 cites·5 claims
- 0278US10876082B2Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Dec 29, 2020·2 cites·14 claims
- 0378US9505951B2Polishing compositionFUJIMI INC·Filed 2013·Granted Nov 29, 2016·5 cites·6 claims
- 0475US10478939B2Polishing methodFUJIMI INC·Filed 2016·Granted Nov 19, 2019·2 cites·6 claims
- 0571US10781410B2Composition for surface treatment and method for surface treatment using the sameFUJIMI INC·Filed 2018·Granted Sep 22, 2020·1 cites·10 claims
- 0667US10138396B2Polishing compositionFUJIMI INC·Filed 2016·Granted Nov 27, 2018·1 cites·7 claims
- 0767US2023027432A1Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 0866US11466234B2Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2020·Granted Oct 11, 2022·0 cites·16 claims
- 0966US10414019B2Polishing compositionFUJIMI INC·Filed 2016·Granted Sep 17, 2019·1 cites·11 claims
- 1065US2025084280A1Molybdenum chemical mechanical polishing compounds and methods of use thereofFUJIMI INC·Filed 2024·Application pending·0 cites
- 1162US2024301242A1Molybdenum polishing compositions and methodsFUJIMI INC·Filed 2024·Application pending·0 cites
- 1261US12448544B2Chemical mechanical polishing compositions and methods of use thereofFUJIMI INC·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 1355US11692137B2Intermediate raw material, and polishing composition and composition for surface treatment using the sameFUJIMI INC·Filed 2021·Granted Jul 4, 2023·0 cites·6 claims
- 1454US2025188314A1Polishing compositionFUJIMI INC·Filed 2023·Application pending·0 cites
- 1554US2025230345A1Composition for chemical-mechanical polishing and method for using compositionFUJIMI INC·Filed 2023·Application pending·0 cites
- 1653US12031015B2Quaternary ammonium-based surface modified silica, compositions, methods of making, and methods of use thereofFUJIMI INC·Filed 2022·Granted Jul 9, 2024·0 cites·15 claims
- 1753US2025084281A1Polishing composition and method for polishing substrate using the compositionFUJIMI INC·Filed 2024·Application pending·0 cites
- 1852US2025101262A1Polishing compositionFUJIMI INC·Filed 2024·Application pending·0 cites
- 1951US11702570B2Polishing compositionFUJIMI INC·Filed 2020·Granted Jul 18, 2023·0 cites·23 claims
- 2051US2025304841A1System and a method for chemical mechanical planarization, and a composition kit, a rinse composition, and a planarization method used in the sameFUJIMI INC·Filed 2025·Application pending·0 cites
- 2149US12391848B2Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2021·Granted Aug 19, 2025·0 cites·8 claims
- 2246US11162057B2Composition for surface treatment, method for producing composition for surface treatment, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Nov 2, 2021·0 cites·12 claims
- 2345US10781342B2Polishing compositionFUJIMI INC·Filed 2016·Granted Sep 22, 2020·0 cites·12 claims
- 2442US11028340B2Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Jun 8, 2021·0 cites·21 claims
- 2541US2020095467A1Intermediate raw material, and polishing composition and composition for surface treatment using the sameFUJIMI INC·Filed 2019·Application pending·0 cites
- 2641US2015322294A1Polishing compositionFUJIMI INC·Filed 2013·Application pending·0 cites
- 2740US2021079264A1Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2020·Application pending·0 cites
- 2839US2020095468A1Tungsten dissolution inhibitor, and polishing composition and composition for surface treatment using the sameFUJIMI INC·Filed 2019·Application pending·0 cites
- 2939US2020017719A1Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Application pending·0 cites
- 3038US2021005462A1Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2019·Application pending·0 cites
- 3137US11339310B2Polishing compositionFUJIMI INC·Filed 2018·Granted May 24, 2022·0 cites·15 claims
- 3233US2019112196A1Cation-modified silica raw material dispersionFUJIMI INC·Filed 2017·Application pending·0 cites
- 3333US2019085207A1Polishing composition for object to be polished having metal-containing layerFUJIMI INC·Filed 2017·Application pending·0 cites
- 3432US2018215952A1Polishing compositionFUJIMI INC·Filed 2015·Application pending·0 cites
- 3528US2014014872A1Polishing composition and polishing methodTAMADA SHUICHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →