Inventor · disambiguated record
Shimon Osada
Also filed as: OSADA Shimon
1 granted patent·2 pending applications·0 citations·filing 2019–2019
9Inventor score
Technology areasH10P
Files withSHOWA DENKO KK3
Top patents by PatentIndex Score
3 records- 0141US12116675B2Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Granted Oct 15, 2024·0 cites·11 claims
- 0233US2022059327A1Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Application pending·0 cites
- 0333US2022064777A1Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →