Inventor · disambiguated record
Shoichi Osada
Also filed as: OSADA SHOICHI
29 granted patents·13 pending applications·182 citations·filing 1993–2025
96Inventor score
Top patents by PatentIndex Score
42 records- 0179US8022137B2Silicone resin composition for optical semiconductor devicesSHINETSU CHEMICAL CO·Filed 2009·Granted Sep 20, 2011·9 cites·4 claims
- 0278US12305036B2Epoxy resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Granted May 20, 2025·1 cites·15 claims
- 0374US6630745B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Oct 7, 2003·18 cites·9 claims
- 0473US7511383B2Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devicesSHINETSU CHEMICAL CO·Filed 2006·Granted Mar 31, 2009·2 cites·5 claims
- 0571US7095125B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 22, 2006·15 cites·9 claims
- 0668US2024263004A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0767US7910638B2Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2009·Granted Mar 22, 2011·1 cites·17 claims
- 0867US2025382494A1Motor-sealing resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0963US7969027B2Semiconductor device encapsulated with resin compositionSHINETSU CHEMICAL CO·Filed 2007·Granted Jun 28, 2011·3 cites·12 claims
- 1062US6783859B2Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 31, 2004·10 cites·3 claims
- 1161US7999016B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2005·Granted Aug 16, 2011·2 cites·7 claims
- 1261US7122587B2Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Oct 17, 2006·10 cites·6 claims
- 1360US11639410B2Heat-curable resin composition and uses thereofSHINETSU CHEMICAL CO·Filed 2020·Granted May 2, 2023·0 cites·29 claims
- 1460US6518332B2Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Feb 11, 2003·9 cites·12 claims
- 1559US9633921B2Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin compositionSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 25, 2017·1 cites·6 claims
- 1659US2022372274A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1758US10676635B2Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 9, 2020·0 cites·5 claims
- 1858US6221509B1Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithTATSUMORI LTD·Filed 1999·Granted Apr 24, 2001·26 cites·14 claims
- 1958US2020392340A1Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2056US6162878ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Dec 19, 2000·21 cites·13 claims
- 2153US6291556B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Sep 18, 2001·5 cites·10 claims
- 2252US11028269B2Silicone-modified epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 8, 2021·0 cites·3 claims
- 2352US2023399467A1Resin composition for encapsulating semiconductor element-mounted surface of substrate with semiconductor element mounted thereon or semiconductor element-forming surface of wafer with semiconductor element formed thereon, and use thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2450US10851261B2Semiconductor-encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 1, 2020·0 cites·6 claims
- 2549US8048969B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted Nov 1, 2011·0 cites·6 claims
- 2649US6297306B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Oct 2, 2001·15 cites·9 claims
- 2749US2025382409A1Thermosetting resin composition and use thereofSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 2847US8796375B2Prepreg, metal-clad laminate, printed wiring board, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2012·Granted Aug 5, 2014·0 cites·4 claims
- 2945US7898094B2Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 2007·Granted Mar 1, 2011·0 cites·9 claims
- 3045US6894091B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted May 17, 2005·1 cites·13 claims
- 3145US2023312909A1Thermosetting resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3245US2008083995A1Epoxy resin composition for encapsulating semiconductor device and thin semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 3343US6160078ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1998·Granted Dec 12, 2000·10 cites·20 claims
- 3442US2006216520A1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 3542US2006241215A1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 3641US6274251B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1999·Granted Aug 14, 2001·9 cites·12 claims
- 3739US6168872B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1998·Granted Jan 2, 2001·8 cites·20 claims
- 3837US5688430ASoft ferrite raw material powder, its sintered body, and their production method and apparatusNIPPON STEEL CORP·Filed 1993·Granted Nov 18, 1997·5 cites·8 claims
- 3936US2021024749A1Heat-curable maleimide resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4035US2019127580A1Semiconductor Encapsulating Resin Composition and Semiconductor DeviceSHINETSU CHEMICAL CO·Filed 2018·Application pending·0 cites
- 4132US2016251511A1Resin composition for encapsulating a semiconductor element and a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 4225US6017497AAtomizing roasting furnace for producing ferrite raw material powderNIPPON STEEL CORP·Filed 1997·Granted Jan 25, 2000·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →