Inventor · disambiguated record
Shunsuke Otake
Also filed as: OTAKE SHUNSUKE
6 granted patents·8 pending applications·7 citations·filing 2003–2024
75Inventor score
Top patents by PatentIndex Score
14 records- 0182US11442205B2Optical prism with interlockAPPLE INC·Filed 2019·Granted Sep 13, 2022·2 cites·19 claims
- 0281US10674612B2Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layerHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jun 2, 2020·3 cites·8 claims
- 0379US11330721B2Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin filmHITACHI CHEMICAL CO LTD·Filed 2020·Granted May 10, 2022·1 cites·7 claims
- 0471US2024369744A1Optical prism with interlockAPPLE INC·Filed 2024·Application pending·0 cites
- 0570US11147166B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 12, 2021·1 cites·6 claims
- 0668US12066644B2Optical prism with interlockAPPLE INC·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 0765US2025283793A1Reliability test method for printed wiring board substrateRESONAC CORP·Filed 2024·Application pending·0 cites
- 0857US2004010338A1Shared vehicle distribution instruction apparatus and vehicle reservation control apparatusHONDA MOTOR CO LTD·Filed 2003·Application pending·0 cites
- 0956US12007413B2Prober controlling device, prober controlling method, and proberTOKYO SEIMITSU CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·8 claims
- 1050US2024088051A1Method for producing semiconductor device, wiring board, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 1148US2023356498A1Organic core material, production method for same, laminate including organic core material, and circuit boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 1248US2024381529A1Method for manufacturing substrate material for semiconductor package, prepreg, and application for prepregRESONAC CORP·Filed 2021·Application pending·0 cites
- 1348US2023331946A1Method for manufacturing substrate material for semiconductor package, prepreg, and substrate material for semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 1435US2019241694A1Curable composition for forming elastic resin layerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →