Inventor · disambiguated record
Shirou Ozaki
Also filed as: OZAKI SHIROU
58 granted patents·27 pending applications·108 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
85 records- 0189US7262142B2Semiconductor device fabrication methodFUJITSU LTD·Filed 2005·Granted Aug 28, 2007·14 cites·17 claims
- 0288US8866157B2Semiconductor device and method of fabricating the semiconductor deviceFUJITSU LTD·Filed 2013·Granted Oct 21, 2014·9 cites·20 claims
- 0387US10043897B2Semiconductor device and method of fabricating semiconductor deviceFUJITSU LTD·Filed 2015·Granted Aug 7, 2018·5 cites·9 claims
- 0487US9755061B2Semiconductor device and method for producing the same, power supply device, and high-frequency amplifierFUJITSU LTD·Filed 2014·Granted Sep 5, 2017·7 cites·9 claims
- 0587US9165851B2Semiconductor device, method for manufacturing the same, power supply apparatus and high-frequency amplification unitOZAKI SHIROU·Filed 2012·Granted Oct 20, 2015·9 cites·11 claims
- 0686US9553152B2Semiconductor deviceFUJITSU LTD·Filed 2014·Granted Jan 24, 2017·8 cites·10 claims
- 0785US9412830B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2015·Granted Aug 9, 2016·3 cites·14 claims
- 0884US8956967B2Method of forming an interconnection structureOZAKI SHIROU·Filed 2012·Granted Feb 17, 2015·5 cites·15 claims
- 0983US10043727B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2016·Granted Aug 7, 2018·3 cites·23 claims
- 1083US7476970B2Composition for forming insulating film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jan 13, 2009·7 cites·1 claims
- 1179US9035353B2Compound semiconductor device comprising electrode above compound semiconductor layer and method of manufacturing the sameOHKI TOSHIHIRO·Filed 2012·Granted May 19, 2015·5 cites·17 claims
- 1278US9608083B2Semiconductor deviceFUJITSU LTD·Filed 2015·Granted Mar 28, 2017·2 cites·10 claims
- 1377US10276671B2Semiconductor device, method for manufacturing semiconductor device, and electronic deviceFUJITSU LTD·Filed 2017·Granted Apr 30, 2019·2 cites·12 claims
- 1477US8431464B2Process for producing silicic coating, silicic coating and semiconductor deviceKOBAYASHI YASUSHI·Filed 2010·Granted Apr 30, 2013·2 cites·19 claims
- 1576US10796917B2Method for manufacturing gate insulator for HEMTFUJITSU LTD·Filed 2019·Granted Oct 6, 2020·1 cites·6 claims
- 1675US9324808B2Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Granted Apr 26, 2016·3 cites·4 claims
- 1775US2024297246A1Semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2024·Application pending·0 cites
- 1873US10468514B2Semiconductor device and method for producing the same, power supply device, and high-frequency amplifierFUJITSU LTD·Filed 2017·Granted Nov 5, 2019·1 cites·6 claims
- 1973US10276703B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2017·Granted Apr 30, 2019·2 cites·14 claims
- 2073US7728065B2Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jun 1, 2010·5 cites·8 claims
- 2170US7875981B2Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Granted Jan 25, 2011·1 cites·15 claims
- 2268US9660065B2Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact holeFUJITSU LTD·Filed 2014·Granted May 23, 2017·1 cites·4 claims
- 2368US8487384B2Semiconductor device, power-supply unit, amplifier and method of manufacturing semiconductor deviceNAKAMURA NORIKAZU·Filed 2012·Granted Jul 16, 2013·2 cites·6 claims
- 2468US7830012B2Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor deviceFUJITSU LTD·Filed 2010·Granted Nov 9, 2010·2 cites·19 claims
- 2567US7655576B2Insulator film, manufacturing method of multilayer wiring device and multilayer wiring deviceFUJITSU LTD·Filed 2007·Granted Feb 2, 2010·2 cites·9 claims
- 2667US2023275001A1Semiconductor device, semiconductor device fabrication method, and electronic deviceFUJITSU LTD·Filed 2023·Application pending·0 cites
- 2766US12193151B2High-frequency circuit board and antenna moduleFUJITSU LTD·Filed 2023·Granted Jan 7, 2025·0 cites·9 claims
- 2866US9306052B2Compound semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Apr 5, 2016·1 cites·14 claims
- 2966US8716209B2Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor deviceKOBAYASHI YASUSHI·Filed 2009·Granted May 6, 2014·2 cites·28 claims
- 3066US2025300364A1Array antenna moduleFUJITSU LTD·Filed 2025·Application pending·0 cites
- 3164US12369345B2Compound semiconductor device, amplifier, and method for manufacturing compound semiconductor deviceFUJITSU LTD·Filed 2022·Granted Jul 22, 2025·0 cites·19 claims
- 3264US11688663B2Semiconductor device, semiconductor device fabrication method, and electronic deviceFUJITSU LTD·Filed 2020·Granted Jun 27, 2023·0 cites·10 claims
- 3364US8461041B2Semiconductor device and method of manufacturing semiconductor deviceOZAKI SHIROU·Filed 2010·Granted Jun 11, 2013·1 cites·12 claims
- 3463US2022069112A1Semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2021·Application pending·0 cites
- 3562US8791465B2Compound semiconductor device and manufacturing thereforOKAMOTO NAOYA·Filed 2012·Granted Jul 29, 2014·1 cites·8 claims
- 3662US8709886B2Compound semiconductor device and manufacturing method thereforMAKIYAMA KOZO·Filed 2012·Granted Apr 29, 2014·1 cites·6 claims
- 3762US8637409B2Etching method, method for manufacturing semiconductor device, and etching deviceOZAKI SHIROU·Filed 2012·Granted Jan 28, 2014·1 cites·11 claims
- 3862US2025096180A1Semiconductor device, wireless communication device, and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2024·Application pending·0 cites
- 3960US10680073B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2018·Granted Jun 9, 2020·0 cites·10 claims
- 4059US10002942B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2017·Granted Jun 19, 2018·0 cites·17 claims
- 4158US11088044B2Compound semiconductor device and fabrication method therefor, and amplifierFUJITSU LTD·Filed 2019·Granted Aug 10, 2021·0 cites·12 claims
- 4258US7985700B2Composition for forming insulating film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2008·Granted Jul 26, 2011·0 cites·11 claims
- 4357US9779933B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2016·Granted Oct 3, 2017·0 cites·14 claims
- 4457US2024213360A1Semiconductor device, semiconductor device manufacturing method, and electronic deviceFUJITSU LTD·Filed 2023·Application pending·0 cites
- 4556US10056460B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2016·Granted Aug 21, 2018·0 cites·8 claims
- 4656US9966463B2Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact holeFUJITSU LTD·Filed 2017·Granted May 8, 2018·0 cites·10 claims
- 4756US9941401B2Semiconductor device, power supply apparatus and high-frequency amplifierFUJITSU LTD·Filed 2016·Granted Apr 10, 2018·0 cites·6 claims
- 4856US9257514B2Semiconductor device with plural electrodes formed on substrateFUJITSU LTD·Filed 2014·Granted Feb 9, 2016·0 cites·3 claims
- 4956US2015135472A1Substrate processing apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 5055US2024162340A1Semiconductor device and manufacturing methodFUJITSU LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →