Inventor · disambiguated record
Sheng-Liang Pan
Also filed as: PAN SHENG-LIANG
63 granted patents·18 pending applications·1,146 citations·filing 1995–2025
99Inventor score
Top patents by PatentIndex Score
81 records- 0198US11239083B2Tuning threshold voltage through meta stable plasma treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·4 cites·20 claims
- 0298US6821810B1High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagersTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 23, 2004·166 cites·18 claims
- 0397US11688606B2Tuning threshold voltage through meta stable plasma treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 0496US12002718B2Fin field-effect transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0596US10535524B1Tuning threshold voltage through meta stable plasma treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·9 cites·20 claims
- 0696US6274917B1High efficiency color filter process for semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 14, 2001·117 cites·9 claims
- 0794US10510600B1Shared contact structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·10 cites·20 claims
- 0893US6395576B1High efficiency color filter process to improve color balance in semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted May 28, 2002·89 cites·16 claims
- 0993US6171885B1High efficiency color filter process for semiconductor array imaging devicesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 9, 2001·125 cites·11 claims
- 1092US6586322B1Method of making a bump on a substrate using multiple photoresist layersTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 1, 2003·79 cites·16 claims
- 1191US10872826B2Fin field-effect transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·4 cites·20 claims
- 1290US10510553B1Dry ashing by secondary excitationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 1389US2025351504A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1488US6582988B1Method for forming micro lens structuresTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·48 cites·15 claims
- 1587US12376371B2Fin Field-Effect Transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1687US11855153B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 1787US6712260B1Bump reflow method by inert gas plasmaTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 30, 2004·39 cites·61 claims
- 1887US2024387178A1Tuning threshold voltage through meta stable plasma treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1985US12148620B2Tuning threshold voltage through meta stable plasma treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 2085US7450296B2Method and system for patterning alignment marks on a transparent substrateTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 11, 2008·13 cites·12 claims
- 2185US6417022B1Method for making long focal length micro-lens for color filtersTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·12 claims
- 2284US7009772B2High transmittance overcoat for microlens arrays in semiconductor color imagersTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 7, 2006·33 cites·41 claims
- 2383US11923433B2Fin field-effect transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 2483US2024387646A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2582US12237228B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 2681US12217936B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·19 claims
- 2781US6495813B1Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Dec 17, 2002·60 cites·22 claims
- 2880US12293910B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 2979US2023387222A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3078US12424444B2Soft ashing process for forming protective layer on conductive cap layer of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 3178US2024379344A1Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3277US12278277B2Fin field-effect transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 3377US2024379378A1Metal Contacts on Metal Gates and Methods ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3476US11854766B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3576US6849533B2Method for fabricating microelectronic product with attenuated bond pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 1, 2005·25 cites·17 claims
- 3675US11404245B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 2, 2022·1 cites·20 claims
- 3775US10755978B2Shared contact structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·1 cites·20 claims
- 3874US11735481B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 3974US10755945B2Metal contacts on metal gates and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 4074US2023069302A1Shared Contact Structure and Methods for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4174US2024387517A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4273US11527447B2Fin field-effect transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 4373US11121025B2Layer for side wall passivationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 4473US6281140B1Method of reducing the roughness of a gate insulator layer after exposure of the gate insulator layer to a threshold voltage implantation procedureTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 28, 2001·18 cites·15 claims
- 4573US2024395536A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4672US5880019AInsitu contact descum for self-aligned contact processTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Mar 9, 1999·43 cites·19 claims
- 4770US12205816B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 4870US12154784B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 4970US11476159B2Shared contact structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 5070US7611960B2Method and system for wafer backside alignmentTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 3, 2009·5 cites·18 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Sheng-Liang Pan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →