Inventor · disambiguated record

Shing-Chyang Pan

Also filed as: PAN SHING-CHYANG

56 granted patents·9 pending applications·321 citations·filing 2002–2023

98Inventor score

Technology areasH10P H10W C23C H10N B81B

Files withTAIWAN SEMICONDUCTOR MFG CO LTD42 TAIWAN SEMICONDUCTOR MFG17 KO CHUNG-CHI1 LEE BIH-HUEY1 LEE HSIEN MING1

Top patents by PatentIndex Score

65 records

0197US9659811B1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·19 cites·20 claims
0296US9679804B1Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·19 cites·20 claims
0396US8361900B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·36 cites·23 claims
0495US10685873B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 16, 2020·10 cites·20 claims
0595US7193327B2Barrier structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 20, 2007·43 cites·17 claims
0694US10468297B1Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·20 claims
0793US11515474B2Memory device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
0892US11697588B2Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
0992US10862026B2Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 8, 2020·2 cites·20 claims
1091US11479849B2Physical vapor deposition chamber with target surface morphology monitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 25, 2022·2 cites·20 claims
1191US9887072B2Systems and methods for integrated resputtering in a physical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 6, 2018·4 cites·20 claims
1290US11004734B2Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·4 cites·20 claims
1390US10978301B2Morphology of resist mask prior to etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 13, 2021·6 cites·20 claims
1490US7704886B2Multi-step Cu seed layer formation for improving sidewall coverageTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 27, 2010·16 cites·19 claims
1589US10535816B2Via structure, MRAM device using the via structure and method for fabricating the MRAM deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·4 cites·20 claims
1689US6846756B2Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 25, 2005·39 cites·20 claims
1787US11198606B2Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·2 cites·20 claims
1885US12151932B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
1985US10867839B2Patterning methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·3 cites·20 claims
2085US9567668B2Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·3 cites·20 claims
2183US12486566B2Physical vapor deposition chamber with target surface morphology monitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
2282US11991930B2Memory device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
2382US11651993B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
2482US10727045B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·2 cites·20 claims
2581US12245529B2Diffusion barrier layer in programmable metallization cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
2680US6656832B1Plasma treatment method for fabricating microelectronic fabrication having formed therein conductor layer with enhanced electrical propertiesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 2, 2003·30 cites·7 claims
2779US12074058B2Patterning methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
2878US6821905B2Method for avoiding carbon and nitrogen contamination of a dielectric insulating layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 23, 2004·24 cites·25 claims
2977US12451393B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
3077US11778931B2Diffusion barrier layer in programmable metallization cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
3177US11049763B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·1 cites·20 claims
3277US10361112B2High aspect ratio gap fillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·2 cites·20 claims
3377US2023294978A1Structure for microelectromechanical systems (mems) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3475US11814283B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
3574US11322396B2Etch stop layer for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 3, 2022·1 cites·20 claims
3673US11769693B2Metal-based etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
3773US10515788B2Systems and methods for integrated resputtering in a physical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
3870US11676852B2Patterning methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
3969US8252690B2In situ Cu seed layer formation for improving sidewall coverageSU LI-LIN·Filed 2008·Granted Aug 28, 2012·3 cites·9 claims
4069US7805258B2System and method for film stress and curvature gradient mapping for screening problematic wafersTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Sep 28, 2010·3 cites·18 claims
4168US11594678B2Diffusion barrier layer in programmable metallization cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·20 claims
4268US11040870B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
4365US9330915B2Surface pre-treatment for hard mask fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 3, 2016·1 cites·18 claims
4464US7247252B2Method of avoiding plasma arcing during RIE etchingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 24, 2007·12 cites·18 claims
4563US10811263B2Method for forming semiconductor device structure with etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
4663US2020357634A1Method for Manufacturing a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
4761US7030023B2Method for simultaneous degas and baking in copper damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 18, 2006·7 cites·20 claims
4860US7253501B2High performance metallization cap layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 7, 2007·9 cites·13 claims
4957US10510585B2Multi-patterning to form vias with straight profilesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
5056US10522360B2Method for forming semiconductor device structure with etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →