Inventor · disambiguated record
Shekhar Pramanick
Also filed as: PRAMANICK SHEKHAR
61 granted patents·1 pending application·3,412 citations·filing 1994–2002
99Inventor score
Files withADVANCED MICRO DEVICES INC60
Top patents by PatentIndex Score
62 records- 0198US6344410B1Manufacturing method for semiconductor metalization barrierADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 5, 2002·292 cites·8 claims
- 0298US6144099ASemiconductor metalization barrierADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 7, 2000·319 cites·6 claims
- 0397US6670260B1Transistor with local insulator structureADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 30, 2003·124 cites·20 claims
- 0496US5617991AMethod for electrically conductive metal-to-metal bondingADVANCED MICRO DEVICES INC·Filed 1995·Granted Apr 8, 1997·271 cites·22 claims
- 0594US6380019B1Method of manufacturing a transistor with local insulator structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 30, 2002·150 cites·19 claims
- 0694US6221724B1Method of fabricating an integrated circuit having punch-through suppressionADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 24, 2001·156 cites·20 claims
- 0793US6660634B1Method of forming reliable capped copper interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 9, 2003·67 cites·15 claims
- 0893US6184112B1Method of forming a MOSFET transistor with a shallow abrupt retrograde dopant profileADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 6, 2001·136 cites·9 claims
- 0992US6147000AMethod for forming low dielectric passivation of copper interconnectsADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 14, 2000·138 cites·21 claims
- 1090US6734559B1Self-aligned semiconductor interconnect barrier and manufacturing method thereforADVANCED MICRO DEVICES INC·Filed 2000·Granted May 11, 2004·59 cites·20 claims
- 1190US6239021B1Dual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 29, 2001·52 cites·10 claims
- 1290US6022808ACopper interconnect methodology for enhanced electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 8, 2000·105 cites·20 claims
- 1388US6303505B1Copper interconnect with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 16, 2001·87 cites·22 claims
- 1487US6369429B1Low resistance composite contact structure utilizing a reaction barrier layer under a metal layerADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 9, 2002·31 cites·18 claims
- 1586US6060383AMethod for making multilayered coaxial interconnect structureFiled 1998·Granted May 9, 2000·73 cites·17 claims
- 1685US6214731B1Copper metalization with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 10, 2001·75 cites·11 claims
- 1784US5937315ASelf-aligned silicide gate technology for advanced submicron MOS devicesADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 10, 1999·51 cites·8 claims
- 1883US6596598B1T-shaped gate device and method for makingADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 22, 2003·31 cites·24 claims
- 1983US6350678B1Chemical-mechanical polishing of semiconductorsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 26, 2002·38 cites·25 claims
- 2083US6180469B1Low resistance salicide technology with reduced silicon consumptionADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 30, 2001·69 cites·12 claims
- 2183US6165894AMethod of reliably capping copper interconnectsADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 26, 2000·64 cites·15 claims
- 2282US6492266B1Method of forming reliable capped copper interconnectsADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 10, 2002·53 cites·15 claims
- 2381US6054398ASemiconductor interconnect barrier for fluorinated dielectricsADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 25, 2000·59 cites·11 claims
- 2480US6211084B1Method of forming reliable copper interconnectsADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 3, 2001·55 cites·20 claims
- 2577US6117770AMethod for implanting semiconductor conductive layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·52 cites·20 claims
- 2677US6015752AElevated salicide technologyADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 18, 2000·40 cites·18 claims
- 2776US6127193ATest structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 3, 2000·41 cites·20 claims
- 2876US6084271ATransistor with local insulator structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Jul 4, 2000·31 cites·20 claims
- 2976US5994191AElevated source/drain salicide CMOS technologyADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 30, 1999·39 cites·20 claims
- 3074US6143650ASemiconductor interconnect interface processing by pulse laser annealADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 7, 2000·42 cites·12 claims
- 3173US6169039B1Electron bean curing of low-k dielectrics in integrated circuitsADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 2, 2001·41 cites·21 claims
- 3273US5876903AVirtual hard mask for etchingADVANCED MICRO DEVICES INC·Filed 1996·Granted Mar 2, 1999·43 cites·19 claims
- 3372US6362063B1Formation of low thermal budget shallow abrupt junctions for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 26, 2002·41 cites·12 claims
- 3470US6372563B1Self-aligned SOI device with body contact and NiSi2 gateADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 16, 2002·13 cites·9 claims
- 3570US6074937AEnd-of-range damage suppression for ultra-shallow junction formationADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 13, 2000·37 cites·16 claims
- 3669US6008098AUltra shallow junction formation using amorphous silicon layerADVANCED MICRO DEVICES INC·Filed 1996·Granted Dec 28, 1999·36 cites·15 claims
- 3768US6281587B1Multi-layered coaxial interconnect structureADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 28, 2001·13 cites·15 claims
- 3868US6147404ADual barrier and conductor deposition in a dual damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Nov 14, 2000·29 cites·10 claims
- 3967US6362526B1Alloy barrier layers for semiconductorsADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 26, 2002·33 cites·4 claims
- 4065US6087209AFormation of low resistance, ultra shallow LDD junctions employing a sub-surface, non-amorphous implantADVANCED MICRO DEVICES INC·Filed 1998·Granted Jul 11, 2000·32 cites·15 claims
- 4164US6172421B1Semiconductor device having an intermetallic layer on metal interconnectsADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 9, 2001·29 cites·6 claims
- 4264US6117769APad structure for copper interconnection and its formationADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·24 cites·39 claims
- 4364US5504017AVoid detection in metallization patternsADVANCED MICRO DEVICES INC·Filed 1994·Granted Apr 2, 1996·25 cites·33 claims
- 4461US5789310AMethod of forming shallow junctions by entrapment of interstitial atomsADVANCED MICRO DEVICES INC·Filed 1996·Granted Aug 4, 1998·25 cites·3 claims
- 4559US6465345B1Prevention of inter-channel current leakage in semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Oct 15, 2002·22 cites·9 claims
- 4659US6171949B1Low energy passivation of conductive material in damascene process for semiconductorsADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 9, 2001·22 cites·14 claims
- 4757US6344691B1Barrier materials for metal interconnect in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 5, 2002·6 cites·6 claims
- 4857US6165902ALow resistance metal contact technologyADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 26, 2000·18 cites·13 claims
- 4956US6361837B2Method and system for modifying and densifying a porous filmADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 26, 2002·19 cites·3 claims
- 5055US6091123ASelf-aligned SOI device with body contact and NiSi2 gateADVANCED MICRO DEVICES INC·Filed 1998·Granted Jul 18, 2000·12 cites·7 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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