Inventor · disambiguated record
Shengjie Qian
Also filed as: QIAN SHENGJIE
10 granted patents·3 pending applications·7 citations·filing 2013–2022
79Inventor score
Files withVAYO SHANGHAI TECH CO LTD13
Top patents by PatentIndex Score
13 records- 0179US11775731B2Stencil-avoidance design method and device, electronic device and storage mediumVAYO SHANGHAI TECH CO LTD·Filed 2021·Granted Oct 3, 2023·2 cites·11 claims
- 0271US11330705B2Method, system and apparatus for detecting polarity of component, and computer-readable storage mediumVAYO SHANGHAI TECH CO LTD·Filed 2017·Granted May 10, 2022·2 cites·10 claims
- 0364US9791851B2Quick processing system and method for SMT equipmentVAYO (SHANGHAI) TECH CO LTD·Filed 2013·Granted Oct 17, 2017·2 cites·10 claims
- 0463US10810347B2PCBA inspection method and system based on 3D AOI and AXIVAYO SHANGHAI TECH CO LTD·Filed 2017·Granted Oct 20, 2020·1 cites·8 claims
- 0551US2024244759A1Method and System for Generating Spray Patterns, Electronic Device, and Storage MediumVAYO SHANGHAI TECH CO LTD·Filed 2022·Application pending·0 cites
- 0645US11604916B2Method, system, and electronic device for detecting open/short circuit of PCB design layoutVAYO SHANGHAI TECH CO LTD·Filed 2019·Granted Mar 14, 2023·0 cites·16 claims
- 0745US2025322335A1Pcba first article inspection method and system, electronic device, and storage mediumVAYO SHANGHAI TECH CO LTD·Filed 2022·Application pending·0 cites
- 0845US2024237223A1Method and system for generating jet printing data, electronic device, and storage mediumVAYO SHANGHAI TECH CO LTD·Filed 2022·Application pending·0 cites
- 0944US12111811B2EDA pad package library updating/application method and system, medium and terminalVAYO SHANGHAI TECH CO LTD·Filed 2018·Granted Oct 8, 2024·0 cites·13 claims
- 1044US12073164B2Stencil step design method and system, computer readable storage medium, and deviceVAYO SHANGHAI TECH CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·9 claims
- 1143US11921776B2Surface mount data conversion method, system, medium and device based on component three-dimensional databaseVAYO SHANGHAI TECH CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·8 claims
- 1239US12353814B2System-in-package technology-based process design method and system, medium, and deviceVAYO SHANGHAI TECH CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·13 claims
- 1332US10824785B2PCB stencil manufacturing method and systemVAYO SHANGHAI TECH CO LTD·Filed 2016·Granted Nov 3, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →