Inventor · disambiguated record

Shujie Qu

Also filed as: QU SHUJIE

1 granted patent·0 citations·filing 2019–2019

10Inventor score

Technology areasY10T

Files withSHOWA DENKO MATERIALS CO LTD1

Top patents by PatentIndex Score

1 record

0139US12241000B2Moisture-curable hot-melt adhesive composition, bonded object, and garmentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 4, 2025·0 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →