Inventor · disambiguated record
Shao-Pin Ru
Also filed as: RU SHAO-PIN
4 granted patents·10 pending applications·3 citations·filing 2002–2019
61Inventor score
Top patents by PatentIndex Score
14 records- 0156US10374104B2Waterproof electronic packaging structure and method for making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2017·Granted Aug 6, 2019·1 cites·17 claims
- 0246US2013127004A1Image Sensor Module Package and Manufacturing Method ThereofRU SHAO-PIN·Filed 2012·Application pending·0 cites
- 0338US2016247696A1Interposer and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2016·Application pending·0 cites
- 0437US6903456B2Package carrier having multiple individual ceramic substratesTONG HSING ELECTRIC IND LTD·Filed 2003·Granted Jun 7, 2005·1 cites·4 claims
- 0537US2019377151A1Optical device and a method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2019·Application pending·0 cites
- 0636US6800211B2Method for removing voids in a ceramic substrateTONG HSING ELECTRIC IND LTD·Filed 2002·Granted Oct 5, 2004·1 cites·1 claims
- 0736US2006096780A1Thin film circuit integrating thick film resistors thereonTONG HSING ELECTRIC IND LTD·Filed 2005·Application pending·0 cites
- 0836US2015292099A1Interposer and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2015·Application pending·0 cites
- 0935US2019305024A1Chip packaging device and method of making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2019·Application pending·0 cites
- 1032US7100270B2Method of fabricating a thin film integrated circuit with thick film resistorsTONG HSING ELECTRIC IND LTD·Filed 2003·Granted Sep 5, 2006·0 cites·6 claims
- 1130US2013155629A1Hermetic Semiconductor Package Structure and Method for Manufacturing the sameRU SHAO-PIN·Filed 2012·Application pending·0 cites
- 1229US2013153016A1Solar Cell Flip Chip Package Structure and Method for Manufacturing the sameRU SHAO-PIN·Filed 2011·Application pending·0 cites
- 1329US2006024901A1Method for fabricating a high-frequency and high-power semiconductor moduleTONG HSING ELECTRIC IND LTD·Filed 2004·Application pending·0 cites
- 1429US2005050724A1Method for fabricating high density of multi-polyimide-layer DPC lines on a ceramic boardFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →