Inventor · disambiguated record
Shigeki Sakaguchi
Also filed as: SAKAGUCHI SHIGEKI
12 granted patents·3 pending applications·174 citations·filing 1981–2020
91Inventor score
Files withCENTRAL GLASS CO LTD3PANASONIC IP MAN CO LTD3FURUSAWA AKIO2MATSUSHITA ELECTRONICS CORP2NIPPON TELEGRAPH & TELEPHONE2
Top patents by PatentIndex Score
15 records- 0188US9746259B2Heat conductor and device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 29, 2017·4 cites·18 claims
- 0276US5059475AApparatus and method of forming optical waveguides on metalized substratesPHOTONIC INTEGRATION RES·Filed 1990·Granted Oct 22, 1991·47 cites·10 claims
- 0372US5064266ACircular channel waveguides and lenses formed from rectangular channel waveguidesPHOTONIC INTEGRATION RES·Filed 1990·Granted Nov 12, 1991·38 cites·13 claims
- 0468US12195911B2Heat insulating sheet and method of manufacturing thereof, and electronic device and battery unit using heat insulating sheetPANASONIC IP MAN CO LTD·Filed 2020·Granted Jan 14, 2025·0 cites·10 claims
- 0559US5655046AGlass composition, optical fiber made of same, and method for preparing glassesNIPPON TELEGRAPH & TELEPHONE·Filed 1995·Granted Aug 5, 1997·30 cites·3 claims
- 0659US4351657AMethod for coating optical fibers with thermoplastic resinNIPPON TELEGRAPH & TELEPHONE·Filed 1981·Granted Sep 28, 1982·20 cites·19 claims
- 0758US8227090B2Bonding material, electronic component, bonding structure and electronic deviceFURUSAWA AKIO·Filed 2007·Granted Jul 24, 2012·1 cites·16 claims
- 0858US6750320B2Process for producing polyimide platy objectCENTRAL GLASS CO LTD·Filed 2002·Granted Jun 15, 2004·3 cites·15 claims
- 0954US6215174B1Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frameMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Apr 10, 2001·18 cites·5 claims
- 1049US6917118B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 12, 2005·3 cites·8 claims
- 1149US2018154612A1Bonding material, bonded body obtained by the same, and manufacturing method of bonded bodyPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 1243US6335223B1Method for producing a resin-sealed semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Jan 1, 2002·10 cites·17 claims
- 1343US2010294550A1Bonding material, electronic component and bonded structureFURUSAWA AKIO·Filed 2008·Application pending·0 cites
- 1439US7333704B2Multichannel optical path changing device and its production methodCENTRAL GLASS CO LTD·Filed 2004·Granted Feb 19, 2008·0 cites·3 claims
- 1539US2006001949A1Fibre optic amplifier moduleCENTRAL GLASS CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →