Inventor · disambiguated record
Shoji Sakemi
Also filed as: SAKEMI SHOJI
28 granted patents·1,015 citations·filing 1994–2010
97Inventor score
Top patents by PatentIndex Score
28 records- 0197US6350664B1Semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 26, 2002·171 cites·22 claims
- 0294US6784112B2Method for surface treatment of silicon based substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·81 cites·7 claims
- 0391US5516032AMethod for forming bump electrodeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted May 14, 1996·61 cites·9 claims
- 0489US5489750AMethod of mounting an electronic part with bumps on a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Feb 6, 1996·111 cites·14 claims
- 0586US5655704AMethod and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 12, 1997·91 cites·11 claims
- 0683US5909633AMethod of manufacturing an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 1, 1999·72 cites·14 claims
- 0782US5657528AMethod of transferring conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 19, 1997·47 cites·12 claims
- 0880US6683379B2Semiconductor device with reinforcing resin layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 27, 2004·25 cites·5 claims
- 0979US5713126AMethod of mounting electronic connector on an end of printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Feb 3, 1998·45 cites·11 claims
- 1079US5680984AApparatus and method for mounting soldering balls onto surfaces of electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 28, 1997·51 cites·12 claims
- 1176US8557630B2Electronic component mounting method and electronic component mount structureSAKEMI SHOJI·Filed 2010·Granted Oct 15, 2013·6 cites·7 claims
- 1272US6179198B1Method of soldering bumped work by partially penetrating the oxide film covering the solder bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 30, 2001·41 cites·6 claims
- 1371US5750199AApparatus and method for mounting soldering balls onto surfaces of electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 12, 1998·34 cites·2 claims
- 1466US6468582B1Method of solder pre-coating and solder pre-coated circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 22, 2002·11 cites·6 claims
- 1566US5894984AStructure of electronic parts and method of soldering electronic parts to substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 20, 1999·31 cites·7 claims
- 1664US5666721AMethod of soldering an electronic connector on a printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 16, 1997·25 cites·15 claims
- 1760US5983490AConductive ball mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 16, 1999·24 cites·4 claims
- 1858US6536105B1Method for mounting conductive balls on a substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·7 cites·16 claims
- 1958US5890283AApparatus and method for mounting electrically conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Apr 6, 1999·24 cites·8 claims
- 2056US6109509AMethod of securely mounting conductive ballsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Aug 29, 2000·18 cites·5 claims
- 2155US6617675B2Semiconductor device and semiconductor device assemblyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 9, 2003·6 cites·8 claims
- 2253US6852572B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 8, 2005·5 cites·22 claims
- 2350US7138034B2Electrode member used in a plasma treating apparatusKROSAKI HARIMA CORP·Filed 2002·Granted Nov 21, 2006·4 cites·8 claims
- 2449US7074720B2Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 11, 2006·2 cites·11 claims
- 2549US6723651B2Plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 20, 2004·2 cites·6 claims
- 2640US5817542AMethod for bonding electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 6, 1998·8 cites·5 claims
- 2739US5802712AElectronic device mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Sep 8, 1998·7 cites·3 claims
- 2836US5548891AMethod of automatically mounting electronic connector onto an end of printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 27, 1996·5 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Shoji Sakemi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →