Inventor · disambiguated record
Shigeo Sase
Also filed as: SASE SHIGEO
10 granted patents·116 citations·filing 1979–2006
89Inventor score
Top patents by PatentIndex Score
10 records- 0182US7392694B2Tire condition monitor device and method of manufacturing the sameTAIHEIYO KOGYO KK·Filed 2006·Granted Jul 1, 2008·4 cites·8 claims
- 0281US6696155B1Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 1996·Granted Feb 24, 2004·34 cites·59 claims
- 0378US4283319AProcess for preparing foundry cores or molds and binder materials used thereforHITACHI CHEMICAL CO LTD·Filed 1979·Granted Aug 11, 1981·22 cites·18 claims
- 0477US6572968B2Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 3, 2003·11 cites·59 claims
- 0560US6329474B1Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazoleHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 11, 2001·10 cites·18 claims
- 0657US6156831AModified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 5, 2000·18 cites·10 claims
- 0755US4362203AProcess for preparing foundry cores or molds and binder materials used thereforHITACHI CHEMICAL CO LTD·Filed 1981·Granted Dec 7, 1982·9 cites·18 claims
- 0849US6692792B2Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 2003·Granted Feb 17, 2004·0 cites·15 claims
- 0948US6465083B1Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the compositionHITACHI CHEMICAL CO LTD·Filed 2000·Granted Oct 15, 2002·3 cites·30 claims
- 1035US6180250B1Epoxy composition for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jan 30, 2001·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →